Low Temperature, Wafer Level Au-In Bonding for ISM Packaging
Qian Wang, Kyudong Jung, Minseog Choi, Woonbae Kim, Sukjin Ham, Byunggil Jeong, Changyoul Moon
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Microstructure of Ag-Sn Bonding for MEMS Packaging
XiaoGang Li, Jian Cai, YoonChul Sohn, Qian Wang, Woonbae Kim, ShuiDi Wang
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
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Conference Proceeding
Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging
KIM, Woonbae, QIAN WANG, JUNG, Kyudong, HWANG, Junsik, MOON, Changyoul
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
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Conference Proceeding
Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging
Jian Cai, Qian Wang, Xiaogang Li, Woonbae Kim, Shuidi Wang, Junsik Hwang, Changyoul Moon
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
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Conference Proceeding
A low temperature, hermetic wafer level packaging method for RF MEMS switch
Woonbae Kim, Qian Wang, Junsik Hwang, Moonchul Lee, Kyudong Jung, SukJin Ham, Changyoul Moon, Kyedong Baeks, Byeoungju Ha, Insang Song
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF
Kim, Woonbae, Ha, Jeongkyu, Jung, Jaemin, Chung, Yechung, Shin, Narae
Year of Publication 26.09.2024
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Year of Publication 26.09.2024
Patent
Novel 1-chip FBAR filter for wireless handsets
Byeoungju Ha, Insang Song, Yunkwon Park, Duckhwan Kim, Woonbae Kim, Kuangwoo Nam, James Jungho Pak
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
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Conference Proceeding
Novel 1-chip FBAR filter for wireless handsets
Ha, Byeoungju, Song, Insang, Park, Yun-Kwon, Kim, Duck-Hwan, Kim, Woonbae, Nam, Kuangwoo, Pak, James Jungho
Published in Sensors and actuators. A. Physical. (14.08.2006)
Published in Sensors and actuators. A. Physical. (14.08.2006)
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Journal Article
A morphology-independent wafer level rivet packaging with Lego-like assembly
Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Moon Koo Kang, Hyeon Cheol Kim, Kukjin Chun
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
Published in The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 (2005)
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Conference Proceeding
TRAY SUPPORT STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
SEONG, Beommo, JUNG, Sanghoon, KIM, Woonbae, PARK, Jinsu, YOON, Byounguk, PARK, Sukchul
Year of Publication 26.06.2024
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Year of Publication 26.06.2024
Patent
TRAY SUPPORT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
SEONG, Beommo, JUNG, Sanghoon, KIM, Woonbae, PARK, Jinsu, YOON, Byounguk, PARK, Sukchul
Year of Publication 27.04.2023
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Year of Publication 27.04.2023
Patent
ELECTRONIC DEVICE COMPRISING DISPLAY MODULE
HWANG, Sungkyu, KIM, Sunghun, YU, Jaewon, LEE, Hyunggeun, LEE, Howon, LEE, Chulhwan, KIM, Woonbae, LIM, Hyungseok, LEE, Younghoon
Year of Publication 27.07.2023
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Year of Publication 27.07.2023
Patent
ELECTRONIC DEVICE INCLUDING SLIDABLE BODY
HWANG, Sungkyu, LEE, Junghoon, LEE, Howon, JIN, Minwook, LEE, Chulhwan, KIM, Woonbae, KIM, Cheolsoo, BAE, Chulho, LEE, Younghoon
Year of Publication 26.04.2023
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Year of Publication 26.04.2023
Patent
Sensor package, method of manufacturing the same, and method of manufacturing lid structure
Kwon, Youngshin, Kim, Woonbae, Choi, Inho, Jung, Eunhee, Jung, Youngdoo, Jo, Sungeun, Kim, Minjin
Year of Publication 28.09.2021
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Year of Publication 28.09.2021
Patent
ELECTRONIC DEVICE INCLUDING SLIDABLE BODY
HWANG, Sungkyu, LEE, Junghoon, LEE, Howon, JIN, Minwook, LEE, Chulhwan, KIM, Woonbae, KIM, Cheolsoo, BAE, Chulho, LEE, Younghoon
Year of Publication 19.01.2022
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Year of Publication 19.01.2022
Patent