Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
Kim, Jong-Seok, Lee, Sang-Woo, Jung, Kyu-Dong, Kim, Woon-Bae, Choa, Sung-Hoon, Ju, Byeong-Kwon
Published in Microelectronics and reliability (01.06.2008)
Published in Microelectronics and reliability (01.06.2008)
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Journal Article
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
KIM JAE CHOON, OH KYUNG SUK, JUNG JAE MIN, KIM WOON BAE, HWANG SEUNG TAE
Year of Publication 05.10.2020
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Year of Publication 05.10.2020
Patent
Integrated circuit chip integrated circuit package and display apparatus including integrated circuit chip
KANG JUN GU, SEONG DAE CHEOL, KIM YOUNG MOK, KIM WOON BAE, CHUNG YUNE SEOK
Year of Publication 20.07.2020
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Year of Publication 20.07.2020
Patent
Trends in the eradication rates of Helicobacterpylori infection for eleven years
Jai Hoon Yoon Gwang Ho Baik Kyoung Min Sohn Dae Yong Kim Yeon Soo Kim Ki Tae Suk Jin Bong Kim Dong Joon Kim Jin Bae Kim Woon Geon Shin Hak Yang Kim Il Hyun Baik Hyun Joo Jang
Published in 世界胃肠病学杂志：英文版 (2012)
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Published in 世界胃肠病学杂志：英文版 (2012)
Journal Article
Chip on film semiconductor packages and display apparatus including the same
PARK, JI YONG, KIM, JUNG WOO, KIM, WOON BAE, JUNG, JAE MIN, HA, JEONG KYU
Year of Publication 16.10.2017
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Year of Publication 16.10.2017
Patent
Flim type semiconductor package and manufacturing method thereof
SEONG, GO WOON, NOH, BO IN, PARK, JI YONG, KIM, JUNG WOO, KIM, WOON BAE
Year of Publication 06.04.2018
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Year of Publication 06.04.2018
Patent
BODY-IMPLANTED SENSED-DATA PROCESSING DEVICE, PACKAGE THEREIN, AND SYSTEM THEREWITH
KONG, YUNG CHEOL, KIM, PYOUNG WAN, UMEMOTO MITSUO, KIM, WOON BAE, CHO, KYONG SOON
Year of Publication 02.03.2016
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Year of Publication 02.03.2016
Patent