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"KIM MINILL"
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"KIM MINILL"
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Apparatus for blanking a printed circuit film
by
Mok JiHoon
,
Kim Youngil
,
Lee Tackkeun
,
Kim Minill
,
Byun Sangmyung
Year of Publication
16.08.2016
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METHOD FOR MANUFACTURING BASE FILM INCLUDING PRINTED CIRCUIT FILMS AND APPARATUS FOR BLANKING THE PRINTED CIRCUIT FILM
by
KIM YOUNGIL
,
LEE TACKKEUN
,
KIM MINILL
,
BYUN SANGMYUNG
,
MOK JIHOON
Year of Publication
04.04.2013
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Reflow apparatus, reflow method, and package apparatus
by
Kim
,
Minill
,
Lee, Kwang Yong
,
Lee, Jonggi
,
Hong, Ji-Seok
Year of Publication
04.12.2012
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INSERT MEMBER, APPARATUS FOR BLANKING PRINTED CIRCUIT FILM HAVING THE SAME AND METHOD OF BLANKING PRINTED CIRCUIT FILM USING THE APPARATUS
by
KIM SHIN
,
SEONG NAKHWAN
,
LEE TACKKEUN
,
KIM MINILL
,
MYUNG SEUNGYU
Year of Publication
13.09.2012
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Circuit manufacturing apparatus
by
Kim
,
Minill
,
Chung, Taegyeong
,
Lee, Jonggi
,
Lee, Kwang Yong
Year of Publication
08.11.2011
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Circuit manufacturing apparatus
by
CHUNG TAEGYEONG
,
LEE JONGGI
,
KIM MINILL
,
LEE KWANG YONG
Year of Publication
08.11.2011
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Reflow method
by
LEE JONGGI
,
KIM MINILL
,
HONG JI-SEOK
,
LEE KWANG YONG
Year of Publication
17.09.2013
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Coil and semiconductor apparatus having the same
by
LEE JONGGI
,
WOO HYUN JEONG
,
KIM MINILL
,
HONG JI-SEOK
,
LEE KWANG YONG
Year of Publication
16.04.2013
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Reflow Apparatus, Reflow Method, And Package Apparatus
by
LEE JONGGI
,
KIM MINILL
,
HONG JI-SEOK
,
LEE KWANG YONG
Year of Publication
21.03.2013
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Reflow apparatus, reflow method, and package apparatus
by
LEE JONGGI
,
KIM MINILL
,
HONG JI-SEOK
,
LEE KWANG YONG
Year of Publication
04.12.2012
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CIRCUIT MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR CIRCUIT
by
CHUNG TAEGYEONG
,
LEE JONGGI
,
KIM MINILL
,
LEE KWANG YONG
Year of Publication
13.05.2010
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Reflow apparatus, Reflow method, and package apparatus
by
LEE JONGGI
,
KIM MINILL
,
HONG JI-SEOK
,
LEE KWANG YONG
Year of Publication
22.07.2010
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COIL AND SEMICONDUCTOR APPARATUS HAVING THE SAME
by
LEE JONGGI
,
WOO HYUN JEONG
,
KIM MINILL
,
HONG JI-SEOK
,
LEE KWANG YONG
Year of Publication
13.05.2010
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Semiconductor package, semiconductor module, and method for fabricating the semiconductor package
by
LEE JONGGI
,
LEE JONGHO
,
KANG SUNWON
,
KIM MINILL
,
HONG JI-SEOK
,
BAEK SEUNGDUK
,
AHN EUNCHUL
,
JANG CHUL-YONG
,
KIM YOUNG LYONG
,
LEE KWANG YONG
Year of Publication
22.04.2010
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Format
Patent
14 results
14
Subject Area
chemistry
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12
medicine
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sciences
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12
Topic
electricity
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12
electric techniques not otherwise provided for
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11
casings or constructional details of electric apparatus
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manufacture of assemblages of electrical components
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printed circuits
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performing operations
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Language
English
14 results
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esp@cenet
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12
USPTO Issued Patents
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