양면 임베디드 트레이스 기판(ETS)을 갖는 패키지 기판을 사용하는 직접 회로(IC) 패키지, 및 관련 제조 방법
PATIL ANIKET, KANG KUIWON, BUOT JOAN REY VILLARBA, WE HONG BOK, KIM MICHELLE YEJIN
Year of Publication 02.07.2024
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Year of Publication 02.07.2024
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다이-측 내장형 트레이스 기판(ETS) 층 내의 내장된 금속 트레이스들에 결합된 보충 금속 층을 이용하는 집적 회로(IC) 패키지들, 및 관련된 제조 방법들
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Year of Publication 28.05.2024
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Year of Publication 28.05.2024
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적층된 집적 회로 다이들을 갖는 집적 회로 패키지 및 그를 제조하는 방법
TONG JIALING, KANG KUIWON, BUOT JOAN REY VILLARBA, KIM MICHELLE YEJIN
Year of Publication 03.04.2023
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Year of Publication 03.04.2023
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SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL CORE FOR IMPROVED ELECTRICAL SHIELDING AND STRUCTURAL STRENGTH, AND RELATED IC PACKAGES AND FABRICATION METHODS
Kim, Michelle Yejin, Kang, Kuiwon, Buot, Joan Rey Villarba, We, Hong Bok
Year of Publication 24.10.2024
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Year of Publication 24.10.2024
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A SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL CORE FOR IMPROVED ELECTRICAL SHIELDING AND STRUCTURAL STRENGTH, AND RELATED IC PACKAGES AND FABRICATION METHODS
KANG, Kuiwon, KIM, Michelle Yejin, BUOT, Joan Rey Villarba, WE, Hong Bok
Year of Publication 24.10.2024
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Year of Publication 24.10.2024
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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SUPPLEMENTAL METAL LAYER COUPLED TO EMBEDDED METAL TRACES IN A DIE-SIDE EMBEDDED TRACE SUBSTRATE (ETS) LAYER, AND RELATED FABRICATION METHODS
KANG, Kuiwon, HUANG, Ching-Liou, KIM, Michelle Yejin, BUOT, Joan Rey Villarba
Year of Publication 28.08.2024
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Year of Publication 28.08.2024
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PACKAGE COMPRISING A SUBSTRATE HAVING DIELECTRIC LAYERS OF DIFFERING MATERIALS
PATIL, Aniket, KIM, Michelle Yejin, BUOT, Joan Rey Villarba, WE, Hong Bok
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
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PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
PATIL, Aniket, KIM, Michelle Yejin, BUOT, Joan Rey Villarba, WE, Hong Bok
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
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Integrated circuit (IC) package with stacked die wire bond connections, and related methods
Kim, Michelle Yejin, Tong, Jialing, Kang, Kuiwon, Buot, Joan Rey Villarba
Year of Publication 13.06.2023
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Year of Publication 13.06.2023
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