Development of Silicon Substrate for Advanced Multi-Chip Packaging Process with the Enhanced Gettering Ability
An, Jeong-Hoon, Kim, Jang-Seop, Lee, Anselmo Jaehyeong, Park, Hyung-Kook, Park, Hyeung-il, Moon, Byeong-Sam, Lee, Sang- Hyun, Park, Jea-Gun
Published in ECS transactions (25.08.2016)
Published in ECS transactions (25.08.2016)
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Journal Article
The Characteristics of Gettering Ability in Advanced Multi-Chip Packaging Thinned Wafer
An, Jeong-Hoon, Kim, Jang-Seop, Kim, Ja-Young, Lee, Ki-Sang, Kang, Hee-Bog, Moon, Byeong-Sam, Lee, Sang-Hyun, Shin, Yong, Hwang, Sung-Min, Park, Hyun-Yul
Published in ECS transactions (15.03.2013)
Published in ECS transactions (15.03.2013)
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Journal Article
TIMING CONTROLLER AND DISPLAY DEVICE INCLUDING THE SAME
KO, JIN HYUN, CHOI, UNG, KIM, JANG SEOP, KO, HYUN SEOK, HONG, HYUN SEOK
Year of Publication 22.07.2016
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Year of Publication 22.07.2016
Patent
Method for updating alignment mark of vision system in real time
KIM, JANG SEOP, BAE, SUNG MIN, CHAE, SEUNG SU, BAE, JUNG YOUN, BAE, IG SOON, LEE, SANG MIN
Year of Publication 10.05.2017
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Year of Publication 10.05.2017
Patent
calibration method according to shrinkage using a real-time update of the alignment mark
KIM, JANG SEOP, BAE, SUNG MIN, CHAE, SEUNG SU, BAE, JUNG YOUN, BAE, IG SOON, LEE, SANG MIN
Year of Publication 08.03.2017
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Year of Publication 08.03.2017
Patent