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"KIM ANDREW TAE"
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"KIM ANDREW TAE"
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Rethinking review standards in asylum
by
Kim
,
Andrew Tae
-Hyun
Published in
William and Mary law review
(01.11.2013)
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Rethinking review standards in asylum
by
Kim
,
Andrew Tae
-Hyun
Published in
William and Mary law review
(01.11.2013)
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CULTURE MATTERS: CULTURAL DIFFERENCES IN THE REPORTING OF EMPLOYMENT DISCRIMINATION CLAIMS
by
Kim
,
Andrew Tae
-Hyun
Published in
The William and Mary Bill of Rights journal
(01.12.2011)
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Fabrication of phase change memory cell in integrated circuit
by
Linder, Barry
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
09.05.2023
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Switchable metal insulator metal capacitor
by
Linder, Barry
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
15.03.2022
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Bottom electrode structure and method of forming the same
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
28.09.2021
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BEOL electrical fuse
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
06.04.2021
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SWITCHABLE METAL INSULATOR METAL CAPACITOR
by
Linder, Barry
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
04.02.2021
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Reliable resistive random access memory
by
Wu, Ernest Y
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
01.11.2022
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Fabricating vias with lower resistance
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
26.01.2021
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FABRICATION OF PHASE CHANGE MEMORY CELL IN INTEGRATED CIRCUIT
by
Linder, Barry
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
21.01.2021
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BEOL ELECTRICAL FUSE AND METHOD OF FORMING THE SAME
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
24.12.2020
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BOTTOM ELECTRODE STRUCTURE AND METHOD OF FORMING THE SAME
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
10.12.2020
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Fabrication of phase change memory cell in integrated circuit
by
Linder, Barry
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
17.11.2020
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FABRICATION OF PHASE CHANGE MEMORY CELL IN INTEGRATED CIRCUIT
by
Linder, Barry
,
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
17.09.2020
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FABRICATING VIAS WITH LOWER RESISTANCE
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
10.09.2020
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Collar formation for chamfer-less and chamfered vias
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
11.08.2020
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VERTICAL ELECTRICAL FUSE
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
09.04.2020
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MIM capacitor for improved process defect tolerance
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
07.04.2020
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COLLAR FORMATION FOR CHAMFER-LESS AND CHAMFERED VIAS
by
Yang, Chih-Chao
,
Kim
,
Andrew Tae
,
Li, Baozhen
Year of Publication
02.04.2020
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