Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus
Kim, Sunghyup, Lim, Kyeongbin, Lee, Joongha, Park, Sangha, Kim, Junhyung
Year of Publication 05.12.2023
Get full text
Year of Publication 05.12.2023
Patent
WAFER CHUCK TABLE AND WAFER CHUCK SYSTEM
KIM, Hyeonjin, KIM, Sunghyup, LEE, Jonggu, KIM, Jeongdu, KIM, Junghwan
Year of Publication 29.06.2023
Get full text
Year of Publication 29.06.2023
Patent
APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE
HAN, Dongkyeng, KIM, Hyeonjin, KIM, Sunghyup, KIM, Jeongdu, LEE, Jonggu
Year of Publication 22.06.2023
Get full text
Year of Publication 22.06.2023
Patent
SOURCE GAS NOZZLE AND SEMICONDUCTOR WAFER PROCESSING APPARATUS INCLUDING THE SAME
Kim, Sunghyup, Choi, Sebin, Hwang, Byeongho, Lee, Sang Yup, Park, Jiye, Ahn, Taeheung
Year of Publication 15.08.2024
Get full text
Year of Publication 15.08.2024
Patent