The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking
Myung, Woo-Ram, Kim, Kyung-Yeol, Kim, Yongil, Jung, Seung-Boo
Published in Journal of materials science. Materials in electronics (01.11.2017)
Published in Journal of materials science. Materials in electronics (01.11.2017)
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Journal Article
Preferential oxidation of CO over CuO/CeO2 and Pt-Co/Al2O3 catalysts in micro-channel reactors
KIM, Kyung-Yeol, HAN, Jonghee, SUK WOO NAM, LIM, Tae-Hoon, LEE, Ho-In
Published in Catalysis today (29.02.2008)
Published in Catalysis today (29.02.2008)
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Conference Proceeding
Journal Article
Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis
Kim, Kyung-Yeol, Lee, Choong-Jae, Jung, Seung-Boo
Published in Microelectronic engineering (01.02.2021)
Published in Microelectronic engineering (01.02.2021)
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Journal Article
Development of a multi-layered micro-reactor coated with Pt–Co/Al2O3 catalyst for preferential oxidation of CO
Kim, Kyung-Yeol, Nam, Suk Woo, Han, Jonghee, Yoon, Sung Pil, Lim, Tae-Hoon, Lee, Ho-In
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (01.11.2008)
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (01.11.2008)
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Journal Article
Immunotherapy targeting plasma ASM is protective in a mouse model of Alzheimer’s disease
Choi, Byung Jo, Park, Min Hee, Park, Kang Ho, Han, Wan Hui, Yoon, Hee Ji, Jung, Hye Yoon, Hong, Ju Yeon, Chowdhury, Md Riad, Kim, Kyung Yeol, Lee, Jihoon, Song, Im-Sook, Pang, Minyeong, Choi, Min-Koo, Gulbins, Erich, Reichel, Martin, Kornhuber, Johannes, Hong, Chang-Won, Kim, Changho, Kim, Seung Hyun, Schuchman, Edward H., Jin, Hee Kyung, Bae, Jae-sung
Published in Nature communications (24.03.2023)
Published in Nature communications (24.03.2023)
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Journal Article
Electronic package and manufacturing method of Electronic package
MIN KYUNG DEUK, KANG DONG GIL, HA EUN, KIM JANG BAEG, JUNG SEUNG BOO, KIM KYUNG YEOL, NOH TAE JOON, JEONG HAK SAN
Year of Publication 02.07.2024
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Year of Publication 02.07.2024
Patent
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
HA, Eun, KANG, Dong Gil, JUNG, Seung Boo, KIM, Jang Baeg, KIM, Kyung Yeol, NOH, Tae Joon, MIN, Kyung Deuk, JEONG, Hak San
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
METHOD AND APPARATUS FOR PROVIDING AN ADAPTIVE USER INTERFACE IN E-LEARNING
NOH MIN SUNG, KIM YOUNG SUN, HEO JAE WE, KIM KYUNG YEOL, KIM KYUNG HOON, YOON JIN SEO
Year of Publication 13.03.2020
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Year of Publication 13.03.2020
Patent
AI METHOD AND APPARATUS FOR PROVIDING STUDY CONTENTS USING AI TUTOR
NOH MIN SUNG, KIM YOUNG SUN, HEO JAE WE, KIM KYUNG YEOL, KIM KYUNG HOON, YOON JIN SEO
Year of Publication 17.09.2019
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Year of Publication 17.09.2019
Patent
LEARNING CONTENT PROVIDING METHOD AND DEVICE USING AI TUTOR
KIM, Kyung Hoon, KIM, Young Sun, NOH, Min Sung, HEO, Jae We, KIM, Kyung Yeol, YOON, Jin Seo
Year of Publication 12.09.2019
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Year of Publication 12.09.2019
Patent