Search Results - "KIM, Kiyeong" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

by Cho, Jonghyun, Song, Eakhwan, Yoon, Kihyun, Pak, Jun So, Kim, Joohee, Lee, Woojin, Song, Taigon, Kim, Kiyeong, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Yang, Seungtaek, Suh, Minsuk, Byun, Kwangyoo, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)

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Journal Article

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel

by Youngwoo Kim, Jonghyun Cho, Kim, Jonghoon J., Kiyeong Kim, Kyungjun Cho, Subin Kim, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao, Joungho Kim
Published in IEEE transactions on electromagnetic compatibility (01.12.2016)

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Journal Article

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

by Pak, Jun So, Kim, Joohee, Cho, Jonghyun, Kim, Kiyeong, Song, Taigon, Ahn, Seungyoung, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)

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Journal Article

Quantifying Radiation and Physics From Edge-Coupled Signal Connectors

Quantifying Radiation and Physics From Edge-Coupled Signal Connectors

by Xinxin Tian, Halligan, Matthew S., Liangqi Gui, Xiao Li, Kiyeong Kim, Connor, Samuel, Archambeault, Bruce, Cracraft, Michael, Ruehli, Albert, Qingxia Li, Pommerenke, David, Drewniak, James L.
Published in IEEE transactions on electromagnetic compatibility (01.08.2015)

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Journal Article

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

by Kim, Kiyeong, Yook, Jong Min, Kim, Junchul, Kim, Heegon, Lee, Junho, Park, Kunwoo, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)

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Journal Article

Measurement and Analysis of a High-Speed TSV Channel

Measurement and Analysis of a High-Speed TSV Channel

by KIM, Heegon, CHO, Jonghyun, KIM, Jiseong, KIM, Myunghoi, KIM, Kiyeong, LEE, Junho, LEE, Hyungdong, PARK, Kunwoo, CHOI, Kwangseong, BAE, Hyun-Cheol, KIM, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)

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Journal Article

Analysis of Power Distribution Network in glass, silicon interposer and PCB

Analysis of Power Distribution Network in glass, silicon interposer and PCB

by Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, Kim, Joungho, Sundaram, Venky, Tummala, Rao
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)

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Conference Proceeding

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

by KIM, Kiyeong, HWANG, Chulsoon, KOO, Kyoungchoul, CHO, Jonghyun, KIM, Heegon, KIM, Joungho, LEE, Junho, LEE, Hyung-Dong, PARK, Kun-Woo, JUN SO PAK
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2012)

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Journal Article

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

by Heegon Kim, Jonghyun Cho, Joohee Kim, Sumin Choi, Kiyeong Kim, Junho Lee, Kunwoo Park, Pak, Jun So, Joungho Kim
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2015)

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Journal Article

Modeling electromagnetic radiation at high-density PCB/connector interfaces

Modeling electromagnetic radiation at high-density PCB/connector interfaces

by Xinxin Tian, Halligan, Matthew, Xiao Li, Kiyeong Kim, Hung-Chuan Chen, Connor, Samuel, Archambeault, Bruce, Cracraft, Michael, Ruehli, Albert, Drewniak, James
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)

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Conference Proceeding

Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

by Hyunsuk Lee, Heegon Kim, Kiyeong Kim, Jung, Daniel H., Kim, Jonghoon J., Sumin Choi, Jaemin Lim, Joungho Kim, Hyungsoo Kim, Kunwoo Park
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)

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Conference Proceeding

Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure

Protection of a delay-locked loop from simultaneous switching noise coupling using an on-chip electromagnetic bandgap structure

by Chulsoon Hwang, Kiyeong Kim, Jun So Pak, Joungho Kim
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)

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Conference Proceeding

Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer

Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer

by Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Sundaram, Venky, Tummala, Rao, Joungho Kim
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)

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Conference Proceeding

Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

by Sumin Choi, Junyong Park, Jung, Daniel H., Joungho Kim, Heegon Kim, Kiyeong Kim
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)

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Conference Proceeding

RC IGBTRC IGBT having a structure to suppress snapback

RC IGBTRC IGBT having a structure to suppress snapback

by KIM SEONGYUN, YOON TAEYOUNG, KIM JANGHYUN, KIM KIYEONG
Year of Publication 05.12.2023

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Patent

Analysis and Solution for RF Interference Caused by PMIC Noise in Mobile Platforms

Analysis and Solution for RF Interference Caused by PMIC Noise in Mobile Platforms

by Kim, Kiyeong, Shim, Hwan-woo, Hwang, Chulsoon
Published in IEEE transactions on electromagnetic compatibility (01.06.2020)

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Journal Article

SMPS noise modeling and analysis in mobiles at 3-level buck converter-based fast charging mode

SMPS noise modeling and analysis in mobiles at 3-level buck converter-based fast charging mode

by Kiyeong Kim, Hwan-Woo Shim, Scogna, Antonio Ciccomancini, Dong-Sub Kim
Published in 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) (01.06.2017)

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Conference Proceeding

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

by KIM, Jaemin, LEE, Woojin, SHIM, Yujeong, SHIM, Jongjoo, KIM, Kiyeong, JUN SO PAK, KIM, Joungho
Published in IEEE transactions on advanced packaging (01.08.2010)

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Journal Article

IGBTSeparated Buffer Super Junction IGBT

IGBTSeparated Buffer Super Junction IGBT

by KIM SEONGYOON, YOON TAEYOUNG, KIM JANGHYUN, KIM KIYEONG
Year of Publication 19.06.2023

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Patent

SMPS noise managing methodology for RFI solution in mobile platforms

SMPS noise managing methodology for RFI solution in mobile platforms

by Kiyeong Kim, Hyunho Baek, Hwan-woo Shim, Jiheon Yu, Scogna, Antonio Ciccomancini, Dong-Sub Kim
Published in 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (2016)

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Conference Proceeding