Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing
Kim, Eungchul, Lee, Jaewon, Park, Younghun, Shin, Cheolmin, Yang, Jichul, Kim, Taesung
Published in Powder technology (01.03.2021)
Published in Powder technology (01.03.2021)
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Journal Article
Publisher Correction: Free-standing two-dimensional ferro-ionic memristor
Lee, Jinhyoung, Woo, Gunhoo, Cho, Jinill, Son, Sihoon, Shin, Hyelim, Seok, Hyunho, Kim, Min-Jae, Kim, Eungchul, Wang, Ziyang, Kang, Boseok, Jang, Won-Jun, Kim, Taesung
Published in Nature communications (07.11.2024)
Published in Nature communications (07.11.2024)
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Journal Article
Free-standing two-dimensional ferro-ionic memristor
Lee, Jinhyoung, Woo, Gunhoo, Cho, Jinill, Son, Sihoon, Shin, Hyelim, Seok, Hyunho, Kim, Min-Jae, Kim, Eungchul, Wang, Ziyang, Kang, Boseok, Jang, Won-Jun, Kim, Taesung
Published in Nature communications (18.06.2024)
Published in Nature communications (18.06.2024)
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Journal Article
Activation of nitrogen species mixed with Ar and H2S plasma for directly N-doped TMD films synthesis
Cho, Jinill, Seok, Hyunho, Lee, Inkoo, Lee, Jaewon, Kim, Eungchul, Sung, Dougyong, Baek, In-Keun, Lee, Cheol-Hun, Kim, Taesung
Published in Scientific reports (20.06.2022)
Published in Scientific reports (20.06.2022)
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Journal Article
Highly penetrant organic solvent-resistant layer-by-layer assembled ultra-thin barrier coating for confined microchannel devices
Hong, Sunghwan, Yoo, Seong Soo, Choi, Gwan Hyun, Lee, Jun Hyuk, Choi, Yong-Woo, Kim, Minjun, Kim, Eungchul, Kwon, S. Joon, Kim, Da Jeong, Park, Juhyun, Yoo, Pil J.
Published in Composites. Part B, Engineering (01.02.2022)
Published in Composites. Part B, Engineering (01.02.2022)
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Journal Article
Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments
Xu, Lei, Park, Kihong, Lei, Hong, Liu, Pengzhan, Kim, Eungchul, Cho, Yeongkwang, Kim, Taesung, Chen, Chuandong
Published in Friction (01.09.2023)
Published in Friction (01.09.2023)
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Journal Article
Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing
Shin, Cheolmin, Kulkarni, Atul, Kim, Kangjun, Kim, Hojoong, Jeon, Sanghuck, Kim, Eungchul, Jin, Yinhua, Kim, Taesung
Published in International journal of advanced manufacturing technology (01.07.2018)
Published in International journal of advanced manufacturing technology (01.07.2018)
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Journal Article
Remote‐Controllable Interfacial Electron Tunneling at Heterogeneous Molecular Junctions via Tip‐Induced Optoelectrical Engineering
Lee, Jinhyoung, Kim, Eungchul, Cho, Jinill, Seok, Hyunho, Woo, Gunhoo, Yu, Dayoung, Jung, Gooeun, Hwangbo, Hyeon, Na, Jinyoung, Im, Inseob, Kim, Taesung
Published in Advanced science (01.02.2024)
Published in Advanced science (01.02.2024)
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Journal Article
Energy‐Band Engineering by Remote Doping of Self‐Assembled Monolayers Leads to High‐Performance IGZO/p‐Si Heterostructure Photodetectors
Woo, Gunhoo, Lee, Dong Hyun, Heo, Yeri, Kim, Eungchul, On, Sungmin, Kim, Taesung, Yoo, Hocheon
Published in Advanced materials (Weinheim) (01.02.2022)
Published in Advanced materials (Weinheim) (01.02.2022)
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Journal Article
Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing
Kim, Eungchul, Lee, Jaewon, Bae, Chulwoo, Seok, Hyunho, Kim, Hyeong-U, Kim, Taesung
Published in Powder technology (01.01.2022)
Published in Powder technology (01.01.2022)
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Journal Article
High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance
Kim, Taehun, Kim, Seongkyun, Kim, Eungchul, Kim, Taesung, Cho, Jungwan, Song, Changsik, Baik, Seunghyun
Published in Small (Weinheim an der Bergstrasse, Germany) (01.09.2021)
Published in Small (Weinheim an der Bergstrasse, Germany) (01.09.2021)
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Journal Article
Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation
Kim, Eungchul, Hong, Jiah, Hong, Seokjun, Kanade, Chaitanya, Seok, Hyunho, Kim, Hyeong-U, Kim, Taesung
Published in Materials chemistry and physics (15.11.2021)
Published in Materials chemistry and physics (15.11.2021)
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Journal Article
Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction
Lee, Jaewon, Kim, Eungchul, Bae, Chulwoo, Seok, Hyunho, Cho, Jinil, Aydin, Kubra, Kim, Taesung
Published in Materials science in semiconductor processing (01.06.2023)
Published in Materials science in semiconductor processing (01.06.2023)
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Journal Article
Effect of ionic strength on amorphous carbon during chemical mechanical planarization
Oh, Seungjun, Shin, Cheolmin, Kwak, Donggeon, Kim, Eungchul, Kim, Juhwan, Bae, Chulwoo, Kim, Taesung
Published in Diamond and related materials (01.08.2022)
Published in Diamond and related materials (01.08.2022)
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Journal Article
The mechanical effect of soft pad on copper chemical mechanical polishing
Liu, Pengzhan, Nam, Yuna, Lee, Seunghwan, Kim, Eungchul, Jeon, Sanghuck, Park, Kihong, Hong, Seokjun, Kim, Taesung
Published in Materials science in semiconductor processing (01.03.2023)
Published in Materials science in semiconductor processing (01.03.2023)
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Journal Article