Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
KIKUCHI TOSIHARU, UNO TOMOHIRO, SUZUKI YASUHIRO, OHNO YASUHIDE, KONDA MASAHI
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Year of Publication 20.03.1998
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Method of producing fine metal spheres of uniform size
KITAMURA; OSAMU, UNO; TOMOHIRO, KURIBAYASHI; HISAO, MARUYAMA; TADAKATSU, OHNO; YASUHIDE, SUZUKI; YASUHIRO, KIKUCHI; TOSIHARU
Year of Publication 09.06.1998
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Year of Publication 09.06.1998
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Method of forming fine metal spheres of uniform size
ONO YASUHIDE, KIKUCHI TOSIHARU, UNO TOMOHIRO, KURIBAYASHI HISAO, SUZUKI YASUHIRO, MARUYAMA TADAKATSU, KITAMURA OSAMU
Year of Publication 19.12.1997
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Year of Publication 19.12.1997
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METHOD OF FORMING FINE METAL SPHERES OF UNIFORM SIZE
YASUHIRO SUZUKI, HISAO KURIBAYASHI, OSAMU KITAMURA, TOMOHIRO UNO, TADAKATSU MARUYAMA, TOSIHARU KIKUCHI, YASUHIDE OHNO
Year of Publication 30.09.1994
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Year of Publication 30.09.1994
Patent