A new mechanism of signal path charging damage across separated power domain deep N-Well interface
Chu, Yu-Lin, Kuo, Hsi-Yu, Hsu, Sheng-Fu, Tsai, Yung-Sheng, Wang, Ming-Yi, Chang, Chuan-Li, Kiang, Bill, Wu, Kenneth
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
A CDM-like damage mechanism for multiple power domains fabricated with Deep N-well processes
Yu-Lin Chu, Hsi-Yu Kuo, Jinn-Wen Young, Yung-Sheng Tsai, Chin-Yuan Ko, Ming-Yi Wang, Chuan-Li Chang, Kiang, Bill, Wu, Kenneth
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding
Low-K Flip Chip Board Level Reliability on 65nm Technology
Pei-Haw Tsao, Bill Kiang, Wu, K., Abel Chang, Tsomg-Dih Yuan
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Models of multi-dimensional analysis for qualitative data and its application
Huang, Chun-Che, (Bill) Tseng, Tzu-Liang, Li, Ming-Zhong, Gung, Roger R.
Published in European journal of operational research (16.10.2006)
Published in European journal of operational research (16.10.2006)
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Journal Article
Protected solder ball joints in wafer level chip-scale packaging
TSAO PEI-HAW, CHANG KUOIN, KIANG BILL, WANG CHUNG YU, LEE CHIEN-HSUN, LIN CHUNG-YI
Year of Publication 15.09.2015
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Year of Publication 15.09.2015
Patent
Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging
TSAO PEI-HAW, CHANG KUOIN, KIANG BILL, WANG CHUNG YU, LEE CHIEN-HSUN, LIN CHUNG-YI
Year of Publication 14.11.2013
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Year of Publication 14.11.2013
Patent
System-in-package packaging for minimizing bond wire contamination and yield loss
Tsao, Pei-Haw, Kiang, Bill, Lin, Liang-Chen, Niu, Pao-Kang, Liu, I-Tai
Year of Publication 10.07.2012
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Year of Publication 10.07.2012
Patent
Protected solder ball joints in wafer level chip-scale packaging
TSAO PEI-HAW, CHANG KUOIN, KIANG BILL, WANG CHUNG YU, LEE CHIEN-HSIUN, LIN CHUNG-YI
Year of Publication 23.07.2013
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Year of Publication 23.07.2013
Patent
Flip chip power cycling system development and lead free bump power cycling reliability
Wu, M. K. C., Pan, H. Y., Lin, L., Chiu, C., Chou, T., Lu, G., Liu, P., Wu, G., Pu, H. P., Tsai, H. Y., Kiang, B., Wu, K., Lii, M. J., Yu, C. H.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
System-in-package packaging for minimizing bond wire contamination and yield loss
Tsao, Pei-Haw, Kiang, Bill, Lin, Liang-Chen, Niu, Pao-Kang, Liu, I-Tai
Year of Publication 18.05.2010
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Year of Publication 18.05.2010
Patent
Bond pad design to minimize dielectric cracking
Tsao, Pei-Haw, Lin, Liang-Chen, Niu, Pao-Kang, Liu, I-Tai, Kiang, Bill
Year of Publication 16.03.2010
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Year of Publication 16.03.2010
Patent
Solder bump structure and method of manufacturing same
Tsao, Pei-Haw, Kiang, Bill, Niu, Pao-Kang, Lin, Liang-Chen, Liu, I-Tai
Year of Publication 09.02.2010
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Year of Publication 09.02.2010
Patent