135-GHz Micromachined On-Chip Antenna and Antenna Array
Chu, Hui, Guo, Yong-Xin, Lim, Teck-Guan, Khoo, Yee Mong, Shi, Xiangquan
Published in IEEE transactions on antennas and propagation (01.10.2012)
Published in IEEE transactions on antennas and propagation (01.10.2012)
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Journal Article
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Won Kyoung Choi, Soon Wee Ho, Siong Chiew Ong, Ling Xie, Pinjala, D, Dim-Lee Kwong, Yee Mong Khoo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
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Journal Article
Design and development of a multi-die embedded micro wafer level package
Kripesh, V., Rao, V.S., Kumar, A., Sharma, G., Khong Chee Houe, Zhang Xiaowu, Khoo Yee Mong, Navas Khan, John Lau
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Study of high speed interconnects of multiple dies stack structure with Through-Silicon-Via (TSV)
Zhang Wenle, Khoo Yee Mong, Lim Teck Guan, Damaruganath, P, Teo Keng Hwa, Zhang Xiaowu
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
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Conference Proceeding
Integrated Optical Carrier for Optical/Electrical Interconnect
Lim Teck Guan, Khoo Yee Mong, Yoon, Joey Chai Yi, Liang, Calivn Teo Wei, Yi, Germaine Hoe Yen, Yap Guan Jie, Ramana, P V, Tan Chee Wei, Damaruganath, P
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
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Journal Article
Through Silicon Via interposer for millimetre wave applications
Teck Guan Lim, Yee Mong Khoo, Selvanayagam, C. S., Ho, D. S. W., Rui Li, Xiaowu Zhang, Gao Shan, Xiong Yong Zhong
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Wideband bandpass filter design for D-band application
Rui Li, Teck Guan Lim, Soon Wee Ho, Yong Zhong Xiong, Yee Mong Khoo
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
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Conference Proceeding
Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications
Jing Zhang, Ramana, Pamidighantam V, Chandrappan, Jayakrishnan, Chee Wei Tan, Yi Yoon Chai, Yee Mong Khoo, Wei Liang Teo, Shing, John Lau Hon, Gomex, Philbert Oliver, Ting Wang, Ramkumar, V M
Published in IEEE transactions on advanced packaging (01.05.2010)
Published in IEEE transactions on advanced packaging (01.05.2010)
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Journal Article
Band Pass Filter Design and Optimization on High-Resistivity Silicon for 5GHz RF Front End Receiver
Zhou Jinchang, Xiao Xianghua, Liu Shiguo, Nagaya, K., Tsuchiya, Y., Mano, Y., Khoo Yee Mong, Li Hongyu
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Electrical Interconnect Design Optimization for Fully Embedded Board-level Optical Interconnects
Chai, J., Guan Jie Yap, Teck Guan Lim, Chee Wei Tan, Yee Mong Khoo, Teo, C., Li Shiah Lim, Yee, H.L., Ramana, P.V., Lau, J., Chang, R., Tang, T., Chang, H., Chiang, S., Cheng, D., Tseng, T.J.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
High frequency characterization of through silicon via structure
Mong, Khoo Yee, Kee, Chua Eng, Guan, Lim Teck, Enxiao, Liu
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Wafer Level Package and a Method of Forming the Same
KHOO YEE MONG, CHE FAXING, LI RUI, HO SOON WEE DAVID, CHONG SER CHOONG, GAO SHAN, LIM TECK GUAN, ORATTI KALANDAR NAVAS KHAN, LIM YING YING
Year of Publication 03.01.2013
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Year of Publication 03.01.2013
Patent
A WAFER LEVEL PACKAGE AND A METHOD OF FORMING THE SAME
KHOO YEE MONG, CHE FAXING, LI RUI, HO SOON WEE DAVID, NAVAS KHAN ORATTI KALANDAR, CHONG SER CHOONG, GAO SHAN, LIM TECK GUAN, LIM YING YING
Year of Publication 27.09.2012
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Year of Publication 27.09.2012
Patent
Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
KHOO YEE MONG, ORATTIKALANDAR NAVAS KHAN, ZHANG XIAO WU, LIM YAK LONG SAMUEL, CHAI TAI CHONG, VEMPATI SRINIVASA RAO, KHONG CHEE HOUE, LAU HON-SHING JOHN, KRIPESH VAIDYANATHAN
Year of Publication 24.05.2012
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Year of Publication 24.05.2012
Patent
A SUBSTRATE ARRANGEMENT AND A METHOD OF MANUFACTURING A SUBSTRATE ARRANGEMENT
LIM, YAK LONG SAMUEL, ZHANG, XIAO WU, LAU, HONG-SHING JOHN, ORATTI KALANDAR, NAVAS KHAN, KRIPESH, VAIDYANATHAN, KHOO, YEE MONG, CHAI, TAI CHONG, KHONG, CHEE HOUE, VEMPATI, SRINIVASA RAO
Year of Publication 28.01.2010
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Year of Publication 28.01.2010
Patent