Search Results - "KESSLER Angela" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

83-P

83-P

by Kessler, Angela, Cirocco, Robert
Published in Human immunology (01.11.2013)

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Journal Article

83-P: AN ASSOCIATION OF ACTIVATING KIR RECEPTORS ON HIGHER CREATININE LEVELS IN RENAL ACUTE CELLULAR REJECTION

83-P: AN ASSOCIATION OF ACTIVATING KIR RECEPTORS ON HIGHER CREATININE LEVELS IN RENAL ACUTE CELLULAR REJECTION

by Kessler, Angela, Cirocco, Robert
Published in Human immunology (01.11.2013)

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Journal Article

The UV-photodissociation of jet-cooled nitrosobenzene studied by fluorescence excitation spectroscopy of the NO fragment

The UV-photodissociation of jet-cooled nitrosobenzene studied by fluorescence excitation spectroscopy of the NO fragment

by KESSLER, Angela, SLENCZKA, Alkwin, SEILER, Reinhold, DICK, Bernhard
Published in Physical chemistry chemical physics : PCCP (2001)

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Journal Article

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

by HOEGLAUER JOSEF, KESSLER ANGELA, NOEBAUER GERHARD
Year of Publication 31.03.2022

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Patent

Moderation - Seelsorge - Supervision im klinischen Feld der Ethikberatung

Moderation - Seelsorge - Supervision im klinischen Feld der Ethikberatung

by Angela Kessler-Weinrich
Published in Forum Supervision (01.01.2021)

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Journal Article

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

by YUFEREV SERGEY, KESSLER ANGELA, NOEBAUER GERHARD, PALM PETTERI, FEHLER ROBERT
Year of Publication 14.04.2022

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Patent

33-P: A NEW WAY TO QC DTT

33-P: A NEW WAY TO QC DTT

by Mendiolina, Jennifer, Kessler, Angela, Cirocco, Robert
Published in Human immunology (01.11.2013)

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Journal Article

33-P

33-P

by Mendiolina, Jennifer, Kessler, Angela, Cirocco, Robert
Published in Human immunology (01.11.2013)

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Journal Article

PACKAGE WITH INTERCONNECTIONS HAVING DIFFERENT MELTING TEMPERATURES

PACKAGE WITH INTERCONNECTIONS HAVING DIFFERENT MELTING TEMPERATURES

by KESSLER ANGELA, HOEGERL JUERGEN, GRASSMANN ANDREAS, NIKITIN IVAN
Year of Publication 13.02.2019

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Patent

Use of Relative Ratio to analyze Donor Specific Antibody – One center’s experience

Use of Relative Ratio to analyze Donor Specific Antibody – One center’s experience

by Gilbert, Kristin, Mendiolina, Jennifer, Kessler, Angela, Rondon, Andres, Keiser, Ryan, DiSante, Kimberly, Fair, Matthew, Kocher, Timothy, Wetmore, Marilyn, Cirocco, Robert
Published in Human immunology (01.10.2015)

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Journal Article

P030 : THE EFFECTS OF HYPOTONIC DIALYSIS AND SPIN COLUMNS ON SERUM ANTI-HLA IgG LEVELS

P030 : THE EFFECTS OF HYPOTONIC DIALYSIS AND SPIN COLUMNS ON SERUM ANTI-HLA IgG LEVELS

by Solomon, Michael B., Fair, Matthew G., Kessler, Angela, Mendiolina, Jennifer, Cirocco, Robert
Published in Human immunology (01.10.2014)

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Journal Article

PACKAGE WITH INTERCONNECTIONS HAVING DIFFERENT MELTING TEMPERATURES

PACKAGE WITH INTERCONNECTIONS HAVING DIFFERENT MELTING TEMPERATURES

by KESSLER ANGELA, HOEGERL JUERGEN, GRASSMANN ANDREAS, NIKITIN IVAN
Year of Publication 24.05.2018

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Patent

P030

P030

by Solomon, Michael B, Fair, Matthew G, Kessler, Angela, Mendiolina, Jennifer, Cirocco, Robert
Published in Human immunology (01.10.2014)

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Journal Article

MOLDED PACKAGE WITH CHIP CARRIER COMPRISING BRAZED ELECTRICALLY CONDUCTIVE LAYERS

MOLDED PACKAGE WITH CHIP CARRIER COMPRISING BRAZED ELECTRICALLY CONDUCTIVE LAYERS

by PAVIER MARK, PUGATSCHOW ANTON, KESSLER ANGELA, SOBKOWIAK MARCO, HABLE WOLFRAM, RIMBERT RIVIERE CHARLES, SIELAFF MICHAEL
Year of Publication 10.01.2019

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Patent

Die package and method of manufacturing a die package

Die package and method of manufacturing a die package

by Palm, Petteri, Kessler, Angela
Year of Publication 09.07.2024

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Patent

CHIP CARRIER WITH ELECTRICALLY CONDUCTIVE LAYER EXTENDING BEYOND THERMALLY CONDUCTIVE DIELECTRIC SHEET

CHIP CARRIER WITH ELECTRICALLY CONDUCTIVE LAYER EXTENDING BEYOND THERMALLY CONDUCTIVE DIELECTRIC SHEET

by KESSLER ANGELA, HABLE WOLFRAM, HOEGERL JUERGEN, STRASS ACHIM, GRASSMANN ANDREAS, NIKITIN IVAN
Year of Publication 20.04.2018

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Patent

Method of forming a semiconductor module

Method of forming a semiconductor module

by Hoeglauer, Josef, Kessler, Angela, Noebauer, Gerhard
Year of Publication 10.09.2024

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Patent

Package comprising chip contact element of two different electrically conductive materials

Package comprising chip contact element of two different electrically conductive materials

by Kessler, Angela, Grassmann, Andreas
Year of Publication 06.07.2021

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Patent

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN BETWEEN

ENCAPSULATED PACKAGE WITH CARRIER, LAMINATE BODY AND COMPONENT IN BETWEEN

by Scharf, Thorsten, Kessler, Angela
Year of Publication 04.02.2021

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Patent

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM

by MEYER, Thorsten, KESSLER, Angela, SCHARF, Thorsten
Year of Publication 28.03.2024

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Patent

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