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"KESER Lizabeth Ann"
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"KESER Lizabeth Ann"
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인터커넥트 구조체를 갖는 3D 컴포넌트를 내장하기 위한 시스템, 장치, 및 방법
by
RAE DAVID FRASER
,
ALVARADO REYNANTE TAMUNAN
,
KESER LIZABETH ANN
Year of Publication
30.01.2018
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SEMICONDUCTOR DEVICE COMPRISING MOLDING LAYER FOR TOP SIDE AND SIDEWALL PROTECTION
by
KESER
,
Lizabeth Ann
,
ALVARADO, Reynante Tamunan
,
XU, Jianwen
Year of Publication
01.07.2020
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PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES
by
RAE, David, Fraser
,
KESER
,
Lizabeth
,
Ann
Year of Publication
28.02.2018
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Semiconductor package interconnect
by
Keser Lizabeth Ann
,
Alvarado Reynante Tamunan
Year of Publication
31.10.2017
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SEMICONDUCTOR PACKAGE INTERCONNECT
by
KESER
,
Lizabeth Ann
,
ALVARADO, Reynante Tamunan
Year of Publication
23.03.2017
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Package on package (POP) device comprising solder connections between integrated circuit device packages
by
Keser Lizabeth Ann
,
Rae David Fraser
Year of Publication
21.03.2017
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SEMICONDUCTOR PACKAGE INTERCONNECT
by
KESER Lizabeth Ann
,
ALVARADO Reynante Tamunan
Year of Publication
16.03.2017
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System, apparatus, and method for embedding a 3D component with an interconnect structure
by
Keser
,
Lizabeth Ann
,
Rae, David Fraser
,
Alvarado, Reynante Tamunan
Year of Publication
25.12.2018
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Semiconductor device comprising mold for top side and sidewall protection
by
Keser
,
Lizabeth Ann
,
Xu, Jianwen
,
Alvarado, Reynante Tamunan
Year of Publication
27.11.2018
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PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES
by
Keser Lizabeth Ann
,
Rae David Fraser
Year of Publication
27.10.2016
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PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES
by
RAE, David, Fraser
,
KESER
,
Lizabeth
,
Ann
Year of Publication
27.10.2016
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System, apparatus, and method for embedding a device in a faceup workpiece
by
Keser
,
Lizabeth Ann
,
Rae, David Fraser
,
Alvarado, Reynante Tamunan
Year of Publication
29.05.2018
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SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
by
KESER
,
Lizabeth Ann
,
RAE, David Fraser
,
ALVARADO, Reynante Tamunan
Year of Publication
28.03.2018
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SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE
by
KESER
,
Lizabeth Ann
,
RAE, David Fraser
,
ALVARADO, Reynante Tamunan
Year of Publication
28.12.2017
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Semiconductor device comprising mold for top side and sidewall protection
by
ALVARADO REYNANTE TAMUNAN
,
J.XU
,
KESER LIZABETH ANN
Year of Publication
06.01.2016
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Planar fan-out wafer level packaging
by
Keser Lizabeth Ann
,
Rae David Fraser
,
Alvarado Reynante Tamunan
Year of Publication
31.10.2017
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PLANAR FAN-OUT WAFER LEVEL PACKAGING
by
KESER Lizabeth Ann
,
ALVARADO Reynante Tamunan
,
RAE David Fraser
Year of Publication
21.09.2017
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Low profile integrated circuit (IC) package comprising a plurality of dies
by
Gupta Piyush
,
Keser Lizabeth Ann
,
Rae David Fraser
Year of Publication
13.06.2017
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INTEGRATED DEVICE COMPRISING WIRES AS VIAS IN AN ENCAPSULATION LAYER
by
KESER
,
Lizabeth Ann
,
BEZUK, Steve Joseph
,
ALVARADO, Reynante Tamunan
Year of Publication
15.03.2017
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LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY OF DIES
by
Gupta Piyush
,
Keser Lizabeth Ann
,
Rae David Fraser
Year of Publication
22.12.2016
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