Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling
Chang, Junling, Janz, Dirk, Kempe, W, Xie, Xiaoming
Published in Soldering & surface mount technology (01.01.2005)
Published in Soldering & surface mount technology (01.01.2005)
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Journal Article
An investigation on thermal reliability of underfilled PBGA solder joints
Zhang Liji, Wang Li, Xie Xiaoming, Kempe, W.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2002)
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Journal Article
Finite element analysis to develop a new accelerating test method for board level solder joints for high temperature electronics
Neher, W., Kempe, W., Wondrak, W., Sauer, W.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing
Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Kempe, W.
Published in Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 (2003)
Published in Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 (2003)
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Conference Proceeding
Degradation of SnAgCu heatsink attachment during thermal shock cycling
Chang, Junling, Janz, Dirk, Kempe, W., Xie, Xiaoming
Published in Soldering & surface mount technology (01.12.2005)
Published in Soldering & surface mount technology (01.12.2005)
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Journal Article
Flip chip solder joint reliability under harsh environment
Bo, Cheng, Li, Wang, Qun, Zhang, Xia, Gao, Xiaoming, Xie, Kempe, Wolfgang
Published in Soldering & surface mount technology (01.12.2003)
Published in Soldering & surface mount technology (01.12.2003)
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Journal Article
Failures of flip chip assemblies under thermal shock
Bo, Cheng, Li, Wang, Qun, Zhang, Xia, Gao, Xiaoming, Xie, Kempe, Wolfgang
Published in Soldering & surface mount technology (01.12.2003)
Published in Soldering & surface mount technology (01.12.2003)
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Journal Article
On the degradation of the solder joints of underfilled flip chip packages: a case study
Qun, Zhang, Xiaoming, Xie, Liu, Chen, Guozhong, Wang, Zhaonian, Cheng, Kempe, Wolfgang
Published in Soldering & surface mount technology (01.01.2000)
Published in Soldering & surface mount technology (01.01.2000)
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Journal Article
Low Temperature Processing of Highly Integrated Assemblies by Selective Microwave Heating
Diehm, R., Pape, U., Nowottnick, M., Kempe, W.
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding
Solder Pastes for Microwave Application
Nowottnick, M., Scheel, W., Diehm, R., Wiese, J., Kempe, W., Mallah, M., Suppa, M., Fink, P.
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding