Metal via structure
Xu, Yongan, Chen, Hsueh-Chung, Vincent, Daniel J, Mignot, Yann, Sankarapandian, Muthumanickam, Kelly, James J
Year of Publication 10.10.2023
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Year of Publication 10.10.2023
Patent
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
Perfecto, Eric, McHerron, Dale Curtis, SKORDAS, SPYRIDON, Farooq, Mukta Ghate, Kelly, James J
Year of Publication 24.08.2023
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Year of Publication 24.08.2023
Patent
Erratum--"Maximum Inventories in Baggage Claim: A Double Ended Queuing System"
Browne, James J, Kelly, James J, Le Bourgeois, Philippe
Published in Transportation science (01.08.1970)
Published in Transportation science (01.08.1970)
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Journal Article
Cobalt interconnect on same copper barrier process integration at the 7nm node
Mont, Frank W., Xunyuan Zhang, Wei Wang, Kelly, James J., Standaert, Theodorus E., Quon, Roger, Ryan, E. Todd
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Hybrid TIMs for electronic package cooling
Chowdhury, Piyas Bal, Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey Allen, Kelly, James J
Year of Publication 01.03.2022
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Year of Publication 01.03.2022
Patent
Cu-Cu bonding for interconnects on bridge chip attached to chips and packaging substrate
Skordas, Spyridon, Bonam, Ravi K, Farooq, Mukta Ghate, Kelly, James J
Year of Publication 01.02.2022
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Year of Publication 01.02.2022
Patent