Search Results - "KAYA, MICHIKO" :: K.UTB vyhledávací portál

Preparation of novel bio-matrix by the complexation of DNA and metal ions

by Yamada, Masanori, Yokota, Miho, Kaya, Michiko, Satoh, Shuya, Jonganurakkun, Benjamas, Nomizu, Motoyoshi, Nishi, Norio
Published in Polymer (Guilford) (14.11.2005)

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FILM-LIKE ADHESIVE AGENT, ADHESIVE FILM, DICING/DIE-BONDING INTEGRATED FILM, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

by AOYAGI Shota, KAYA Michiko
Year of Publication 21.03.2024

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Patent

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EVALUATION METHOD FOR HEAVY METAL ION PERMEABILITY OF RESIN FILM, AND ADHESIVE FILM

by KAYA MICHIKO, KOSHINO MIHARU
Year of Publication 27.03.2023

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Patent

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EVALUATION METHOD FOR DIE BONDING FILM, DIE BONDING FILM AND DICING AND DIE BONDING INTEGRATED FILM

by KAYA MICHIKO, YAMANAKA DAISUKE
Year of Publication 07.09.2022

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Patent

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다이싱·다이본딩 일체형 필름 및 그 품질 관리 방법, 및 반도체 장치의 제조 방법

by KAYA MICHIKO, TANIGUCHI KOHEI
Year of Publication 30.08.2022

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Patent

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필름상 접착제 및 그 분단성 평가 방법, 다이싱·다이본딩 일체형 필름 및 그 제조 방법, 및 반도체 장치

by KAYA MICHIKO, YAMANAKA DAISUKE
Year of Publication 28.06.2022

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Patent

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광경화성 점착제의 평가 방법, 다이싱·다이본딩 일체형 필름과 그 제조 방법, 및 반도체 장치의 제조 방법

by KAYA MICHIKO, YAMANAKA DAISUKE
Year of Publication 31.08.2021

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Patent

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DICING/DIE-BONDING INTEGRATED FILM, METHOD FOR MANAGING QUALITY OF SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

by TANIGUCHI Kohei, KAYA Michiko
Year of Publication 01.07.2021

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Patent

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FILM-LIKE ADHESIVE, METHOD FOR EVALUATING EASE OF CUTTING OF SAME, DICING/DIE-BONDING INTEGRATED FILM, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE

by YAMANAKA Daisuke, KAYA Michiko
Year of Publication 06.05.2021

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Patent

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점착 시트의 제조 방법, 다이싱·다이본딩 일체형 테이프의 제조 방법, 반도체 장치의 제조 방법, 점착제의 처리 방법, 피착체의 고정화 방법, 및 피착체의 박리 방법

by KAYA MICHIKO, YAMANAKA DAISUKE
Year of Publication 23.02.2021

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Patent

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EVALUATION METHOD FOR LIGHT-CURING ADHESIVE, INTEGRATED DICING AND DIE-BONDING FILM AND MANUFACTURING METHOD FOR SAME, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

by YAMANAKA Daisuke, KAYA Michiko
Year of Publication 02.07.2020

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Patent

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DICING/DIE-BONDING INTEGRATED TAPE

by KAYA MICHIKO
Year of Publication 09.02.2017

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Patent

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METHOD FOR MANUFACTURING ADHESIVE SHEET, METHOD FOR MANUFACTURING DICING/DIE-BONDING TAPE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR TREATING ADHESIVE, METHOD FOR IMMOBILIZING ADHEREND, AND METHOD FOR PEELING ADHEREND

by YAMANAKA Daisuke, KAYA Michiko
Year of Publication 12.12.2019

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Patent

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FILM-FORM ADHESIVE, ADHESIVE FILM, INTEGRATED DICING/DIE BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

by KIMURA Mikiko, AOYAGI Shota, NAKAYAMA Noriyuki, KAYA Michiko
Year of Publication 21.03.2024

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Patent

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광경화성 점착제의 평가 방법, 다이싱·다이본딩 일체형 필름과 그 제조 방법, 및 반도체 장치의 제조 방법

by KAYA MICHIKO, OZAKI YOSHINOBU, OHKUBO KEISUKE
Year of Publication 31.08.2021

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Patent

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METHOD FOR EVALUATING PHOTOCURABLE ADHESIVE, DICING/DIE ATTACH FILM, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

by OZAKI Yoshinobu, OHKUBO Keisuke, KAYA Michiko
Year of Publication 02.07.2020

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Patent

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EVALUATION METHOD FOR DIFFUSIBILITY OF HEAVY METAL ION, STRUCTURE, AND MANUFACTURING METHOD FOR THE SAME

by KOSHINO MIHARU, KAYA MICHIKO, SUN XIAOYIN, NAKAYAMA NORIYUKI, NAKAMURA KANAMI
Year of Publication 11.10.2021

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Patent

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반도체 장치의 제조 방법 및 필름형 접착제

by KAYA MICHIKO, NAKAMURA YUKI, YAHATA TATSUYA, OHKUBO KEISUKE, YAMANAKA DAISUKE
Year of Publication 11.11.2020

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Patent

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METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND FILM-LIKE ADHESIVE

by YAHATA Tatsuya, OHKUBO Keisuke, YAMANAKA Daisuke, NAKAMURA Yuki, KAYA Michiko
Year of Publication 12.09.2019

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Patent

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METHOD OF MANUFACTURING DICING/DIE BONDING INTEGRATED TYPE TAPE

by IWANAGA YUKIHIRO, KAYA MICHIKO, SUZUMURA KOJI, SAKUTA TATSUYA
Year of Publication 15.02.2018

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Patent

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