1 µm Diameter high Aspect Ratio via Formation on RDL Dielectric by Imprinting Technology\ \mu m$ diameter high aspect ratio via formation on RDL dielectric by imprinting technology
Kawashita, Shinya, Honda, Kazutaka, Nishida, Masataka, Makino, Tatsuya, Suzuki, Naoya
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Novel Low Dk/Df Photoimageable Dielectric for Redistribution Layer
Zapico, Guillermo Fernandez, Kawauchi, Fumihiko, Kawashita, Shinya, Hirasawa, Manabu, Sato, Kitaru, Imai, Tetsuya, Kondo, Hidekazu, Makino, Tatsuya
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding