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Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Year of Publication 21.05.2015
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Year of Publication 03.02.2015
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TWI646644B
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Year of Publication 01.01.2019
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Capturing intrinsic impact of low-k dielectric stacks and packaging materials on mechanical integrity of Cu/low-k interconnects
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Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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