Thermosetting resin composition
AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO, WATANABE YOSHIKO
Year of Publication 15.07.2015
Get full text
Year of Publication 15.07.2015
Patent
Method For Manufacturing Liquid Organosilicon Compound, Thermosetting Resin Composition And Use Thereof
AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, SAKAI KIYOSHI, TAJIMA AKIO
Year of Publication 01.07.2015
Get full text
Year of Publication 01.07.2015
Patent
Condensation-curable resin composition, cured product, molded body, and semiconductor device
IKENO, HIRONORI, SUWA, KAZUYA, KAWABATA, KIICHI, NISHIZAWA, KEISUKE, KIYA, AYAKA
Year of Publication 01.09.2020
Get full text
Year of Publication 01.09.2020
Patent
Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor
AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO, WATANABE YOSHIKO
Year of Publication 24.03.2015
Get full text
Year of Publication 24.03.2015
Patent
COMPOUND COMPRISING ISOCYANURIC SKELETON, EPOXY GROUPS, AND ORGANOPOLYSILOXANE OR SILSESQUIOXANE SKELETON HAVING SIH GROUPS, THERMOSETTING RESIN COMPOSITION COMPRISING COMPOUND AS AGENT FOR IMPARTING ADHESION, CURED PRODUCT, AND SEALING MEMBER FOR OPTICAL SEMICONDUCTOR
AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO, WATANABE YOSHIKO
Year of Publication 25.02.2015
Get full text
Year of Publication 25.02.2015
Patent
COMPOUND INCLUDING ORGANOPOLYSILOXANE OR SILSESQUIOXANE SKELETON HAVING ISOCYANURIC SKELETON, EPOXY GROUP AND SIH GROUP, THERMOSETTING RESIN COMPOSITION CONTAINING THE COMPOUND AS ADHESION-IMPARTING AGENT, HARDENED MATERIAL AND SEALING AGENT FOR OPTICAL SEMICONDUCTOR
AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO, WATANABE YOSHIKO
Year of Publication 29.05.2014
Get full text
Year of Publication 29.05.2014
Patent
COMPOUND COMPRISING ISOCYANURIC SKELETON, EPOXY GROUPS, AND SILSESQUIOXANE SKELETON HAVING SIH GROUPS, THERMOSETTING RESIN COMPOSITION COMPRISING COMPOUND AS AGENT FOR IMPARTING ADHESION, CURED PRODUCT, AND SEALING MEMBER FOR OPTICAL SEMICONDUCTO
AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO, WATANABE YOSHIKO
Year of Publication 14.05.2014
Get full text
Year of Publication 14.05.2014
Patent
Organosilicon compound, method for producing organosilicon compound, thermosetting resin composition, molded body, and optical semiconductor device
IKENO, HIRONORI, ICHIKAWA, KOJI, KAWABATA, KIICHI, NISHIZAWA, KEISUKE, ISHIKAWA, KENTARO, KIYA, AYAKA
Year of Publication 01.08.2020
Get full text
Year of Publication 01.08.2020
Patent