Conductive resin composition, high thermal conductive material and semiconductor device
HAMASHIMA, AZUMI, YOSHIDA, MASATO, KASHINO, TOMOMASA, TAKAMOTO, MAKOTO, WATABE, NAOKI
Year of Publication 16.11.2022
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Year of Publication 16.11.2022
Patent
Paste resin composition, high-thermal conductivity material and semiconductor device including silver-containing particles A, a solvent B, and a thermosetting resin C
HAMASHIMA, AZUMI, YOSHIDA, MASATO, ABE, YUI, KASHINO, TOMOMASA, TAKAMOTO, MAKOTO, WATABE, NAOKI
Year of Publication 16.07.2023
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Year of Publication 16.07.2023
Patent