전자 부품을 실장한 기판과 방열판을 구비한 전자 부품 모듈 및 그 제조 방법
YOKOCHI TOMOHIRO, HASEGAWA KENICHIRO, KAJINO HIDETADA, KASAMA YASUNORI
Year of Publication 17.07.2018
Get full text
Year of Publication 17.07.2018
Patent
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREFOR
YOKOCHI TOMOHIRO, HASEGAWA KENICHIRO, KAJINO HIDETADA, KASAMA YASUNORI
Year of Publication 08.06.2017
Get full text
Year of Publication 08.06.2017
Patent
MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREFOR
YOKOCHI TOMOHIRO, HASEGAWA KENICHIRO, HARADA TOSHIICHI, KASAMA YASUNORI
Year of Publication 20.11.2014
Get full text
Year of Publication 20.11.2014
Patent
MULTI-LAYER BOARD AND METHOD OF MANUFACTURING THE SAME
YOKOCHI TOMOHIRO, HARADA TOSHIKAZU, KASAMA YASUNORI, HASEGAWA KENICHIROU
Year of Publication 19.11.2014
Get full text
Year of Publication 19.11.2014
Patent
TWI510156B
YOKOCHI, TOMOHIRO, HASEGAWA, KENICHIROU, KASAMA, YASUNORI, HARADA, TOSHIKAZU
Year of Publication 21.11.2015
Get full text
Year of Publication 21.11.2015
Patent
Multi-layer substrate and manufacturing method thereof
YOKOCHI, TOMOHIRO, HASEGAWA, KENICHIROU, KASAMA, YASUNORI, HARADA, TOSHIKAZU
Year of Publication 16.03.2015
Get full text
Year of Publication 16.03.2015
Patent
Multi-layer substrate and manufacturing method thereof
TOSHIKAZU HARADA, YASUNORI KASAMA, KENICHIROU HASEGAWA, TOMOHIRO YOKOCHI
Year of Publication 12.11.2014
Get full text
Year of Publication 12.11.2014
Patent