by Prerna, Ramalingam, Nithya, Mulla, Zaman Zaid, Ganeshan, Archana, Balakrishnan, Ranjul, Karunan, Anoop
Published in 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (12.12.2022)

by Prerna, Ramalingam, Nithya, Mulla, Zaman Zaid, Ganeshan, Archana, Balakrishnan, Ranjul, Karunan, Anoop
Published in 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2022)

by Nagarajan, Kavitha, Bathini, Aruna, Ong, Ling Li, Karunan, Anoop, Lee, Si Guan
Published in 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2018)

by BALAMURUGAN, Ganesh, KARUNAN, Anoop, KUMAR, Aruna, RADHAKRISHNAN, Prakash
Year of Publication 15.10.2020

by Fornberg, Per E, Kumar L S, Aruna, Bou-Sleiman, Sleiman, Kumar CR, Sunil, Karunan, Anoop
Year of Publication 23.06.2022

by BALAMURUGAN, Ganesh, KARUNAN, Anoop, KUMAR, Aruna, RADHAKRISHNAN, Prakash
Year of Publication 04.01.2018

by Kumar L S, Aruna, Kumar CR, Sunil, Karunan, Anoop, Basu, Sanjib
Year of Publication 10.01.2019

by Balamurugan, Ganesh, Radhakrishnan, Prakash, Kumar, Aruna, Karunan, Anoop
Year of Publication 14.03.2019

by BALAMURUGAN GANESH, KUMAR ARUNA, RADHAKRISHNAN PRAKASH, KARUNAN ANOOP
Year of Publication 15.01.2019