Integrated chip, metal-insulator- metal device and methof for forming the same
YAUNG, DUN-NIAN, KAO, MIN-FENG, LIN, HSINGIH, LIU, JENNG, LIN, KUAN-HUA
Year of Publication 01.11.2023
Get full text
Year of Publication 01.11.2023
Patent
Semiconductor Switching Device Separate by Device Isolation
Liu, Jen-Cheng, Yaung, Dun-Nian, Hsu, Tzu-Hsuan, Chen, Szu-Ying, Tseng, Hsiao-Hui, Hsu, Wei-Cheng, Kao, Min-Feng
Year of Publication 19.11.2020
Get full text
Year of Publication 19.11.2020
Patent
Inductor structure for integrated circuit
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Kao, Min-Feng, Huang, Shih-Han, Wang, Ching-Chun
Year of Publication 10.12.2019
Get full text
Year of Publication 10.12.2019
Patent
Image sensor device
Liu, Jen-Cheng, Yaung, Dun-Nian, Chen, Szu-Ying, Kao, Min-Feng, Hung, Feng-Chi
Year of Publication 25.12.2018
Get full text
Year of Publication 25.12.2018
Patent
Semiconductor structure and method for manufacturing the same
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Kao, Min-Feng, Wang, Ching-Chun
Year of Publication 25.12.2018
Get full text
Year of Publication 25.12.2018
Patent
RÜCKSEITEN- ODER VORDERSEITEN-SUBSTRATDURCHKONTAKTIERUNGSLANDUNG (TSV-LANDUNG) AUF METALL
Liu, Jen-Cheng, Li, Zheng-Xun, Lin, Hsing-Chih, Yaung, Dun-Nian, Kao, Min-Feng
Year of Publication 12.10.2023
Get full text
Year of Publication 12.10.2023
Patent
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
Liu, Jen-Cheng, Wu, Kuo-Ming, Lin, Hsing-Chih, Yaung, Dun-Nian, Lin, Yung-Lung, Chen, I-Nan, Kao, Min-Feng, Wang, Ching-Chun, Huang, Shih-Han
Year of Publication 01.10.2020
Get full text
Year of Publication 01.10.2020
Patent
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
Liu, Jen-Cheng, Wu, Kuo-Ming, Lin, Hsing-Chih, Yaung, Dun-Nian, Lin, Yung-Lung, Chen, I-Nan, Kao, Min-Feng, Wang, Ching-Chun, Huang, Shih-Han
Year of Publication 24.09.2020
Get full text
Year of Publication 24.09.2020
Patent
Interconnect apparatus and method for a stacked semiconductor device
Liu, Jen-Cheng, Yaung, Dun-Nian, Chou, Shih-Pei, Chen, Szu-Ying, Tsai, Shu-Ting, Kao, Min-Feng, Hung, Feng-Chi, Lin, Jeng-Shyan
Year of Publication 01.09.2020
Get full text
Year of Publication 01.09.2020
Patent
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
WANG, CHINGUN, YAUNG, DUN-NIAN, KAO, MIN-FENG, LIN, HSINGIH, LIU, JENNG
Year of Publication 27.09.2018
Get full text
Year of Publication 27.09.2018
Patent
IMAGE SENSOR AND FORMING METHOD THEREOF
YAUNG, DUN-NIAN, KAO, MIN-FENG, KUO, WENANG, LIU, JENNG, HUANG, SHIH-HAN
Year of Publication 21.07.2023
Get full text
Year of Publication 21.07.2023
Patent
Semiconductor switching device separated by device isolation
Liu, Jen-Cheng, Yaung, Dun-Nian, Hsu, Tzu-Hsuan, Chen, Szu-Ying, Tseng, Hsiao-Hui, Hsu, Wei-Cheng, Kao, Min-Feng
Year of Publication 04.08.2020
Get full text
Year of Publication 04.08.2020
Patent
Hybrid bonding technology for stacking integrated circuits
Liu, Jen-Cheng, Wu, Kuo-Ming, Lin, Hsing-Chih, Yaung, Dun-Nian, Lin, Yung-Lung, Chen, I-Nan, Kao, Min-Feng, Wang, Ching-Chun, Huang, Shih-Han
Year of Publication 28.07.2020
Get full text
Year of Publication 28.07.2020
Patent
Semiconductor structure and manufacturing method for the same
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Huang, Kuan-Chieh, Kao, Min-Feng, Wang, Ching-Chun
Year of Publication 28.07.2020
Get full text
Year of Publication 28.07.2020
Patent
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
YAUNG, DUN-NIAN, KAO, MIN-FENG, KUO, WENANG, LIU, JENNG, HUANG, SHIH-HAN
Year of Publication 01.07.2023
Get full text
Year of Publication 01.07.2023
Patent
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
LI, ZHENG-XUN, YAUNG, DUN-NIAN, KAO, MIN-FENG, LIN, HSINGIH, LIU, JENNG
Year of Publication 01.07.2023
Get full text
Year of Publication 01.07.2023
Patent
Through via structure, semiconductor device and manufacturing method thereof
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Kao, Min-Feng, Chen, Hsin-Hung
Year of Publication 14.08.2018
Get full text
Year of Publication 14.08.2018
Patent