STACKED STRUCTURE FOR CMOS IMAGE SENSORS
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Year of Publication 28.07.2022
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Year of Publication 28.07.2022
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IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
Liu, Jen-Cheng, Yaung, Dun-Nian, Li, Sheng-Chan, Chen, Sheng-Chau, Kuo, Wen-Chang, Kao, Min-Feng, Hung, Feng-Chi
Year of Publication 21.07.2022
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Year of Publication 21.07.2022
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Semiconductor structure and manufacturing method for the same
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Huang, Kuan-Chieh, Kao, Min-Feng, Wang, Ching-Chun
Year of Publication 12.07.2022
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Year of Publication 12.07.2022
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BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 07.07.2022
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Year of Publication 07.07.2022
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Image sensor device
Liu, Jen-Cheng, Yaung, Dun-Nian, Chen, Szu-Ying, Kao, Min-Feng, Hung, Feng-Chi
Year of Publication 04.08.2020
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Year of Publication 04.08.2020
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Hybrid bonding technology for stacking integrated circuits
Liu, Jen-Cheng, Wu, Kuo-Ming, Lin, Hsing-Chih, Yaung, Dun-Nian, Lin, Yung-Lung, Chen, I-Nan, Kao, Min-Feng, Wang, Ching-Chun, Huang, Shih-Han
Year of Publication 03.05.2022
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Year of Publication 03.05.2022
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Backside contact to improve thermal dissipation away from semiconductor devices
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 29.03.2022
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Year of Publication 29.03.2022
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INTEGRATED CIRCUIT (IC) STRUCTURE FOR HIGH PERFORMANCE AND FUNCTIONAL DENSITY
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Huang, Kuan-Chieh, Kao, Min-Feng
Year of Publication 27.02.2020
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Year of Publication 27.02.2020
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BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Chen, Che-Wei, Kao, Min-Feng, Chen, Ping-Tzu
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
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INTEGRATED CIRCUIT (IC) STRUCTURE FOR HIGH PERFORMANCE AND FUNCTIONAL DENSITY
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Huang, Kuan-Chieh, Kao, Min-Feng
Year of Publication 06.02.2020
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Year of Publication 06.02.2020
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Integrated circuit (IC) structure for high performance and functional density
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Huang, Kuan-Chieh, Kao, Min-Feng
Year of Publication 17.12.2019
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Year of Publication 17.12.2019
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