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Year of Publication 30.06.2022
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Year of Publication 27.05.2021
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Oversized via as through-substrate-via (TSV) stop layer
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Year of Publication 21.01.2021
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OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Chu, Yi-Shin, Kao, Min-Feng, Chen, Ping-Tzu
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Year of Publication 16.12.2021
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SEMICONDUCTOR DEVICE STRUCTURE
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Year of Publication 24.12.2020
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Liu, Jen-Cheng, Lin, Hsing-Chih, Yaung, Dun-Nian, Tsai, Wei-Tao, Kao, Min-Feng
Year of Publication 03.12.2020
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Year of Publication 03.12.2020
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IMAGE SENSOR
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Year of Publication 01.09.2022
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HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
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Year of Publication 18.08.2022
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Year of Publication 18.08.2022
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Semiconductor structure and method for manufacturing the same
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Year of Publication 20.10.2020
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Year of Publication 20.10.2020
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Hybrid bonding technology for stacking integrated circuits
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Year of Publication 09.08.2022
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Year of Publication 09.08.2022
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Implant isolated devices and method for forming the same
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Year of Publication 07.09.2021
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Year of Publication 07.09.2021
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Year of Publication 08.10.2020
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Year of Publication 08.10.2020
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Semiconductor device structure with back-side layer to reduce leakage
Liu, Jen-Cheng, Yaung, Dun-Nian, Huang, Hsun-Ying, Kao, Min-Feng, Lin, Jeng-Shyan
Year of Publication 29.09.2020
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Year of Publication 29.09.2020
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