High-performance electrodeposited copper wicks for heat-spreading vapor chambers
Yu, Jui-Cheng, Chien, Heng-Chieh, Chiang, Chao-Yang, Liu, En-Chia, Chang, Yu-Hsiang, Huang, Hung-Hsien, Chen, Tang-Yuan, Kao, Chin-Li, Liao, Chien-Neng
Published in Applied thermal engineering (25.06.2023)
Published in Applied thermal engineering (25.06.2023)
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Journal Article
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
Huang, Jeng-Hau, Shih, Po-Shao, Renganathan, Vengudusamy, Gräfner, Simon Johannes, Lin, Yu-Chun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Kao, Chengheng Robert
Published in Materials (01.04.2024)
Published in Materials (01.04.2024)
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Journal Article
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
Kung, Po-Yu, Huang, Wei-Lun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Kao, C. R.
Published in Materials (01.11.2022)
Published in Materials (01.11.2022)
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Journal Article
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper
Ou, Jou-Chun, Tsai, Yi-Yun, Lin, Ting-Chun, Kao, Chin-Li, Hsiao, Shih-Chieh, Huang, Fei-Ya, Kuo, Jui-Chao
Published in AIP advances (01.06.2022)
Published in AIP advances (01.06.2022)
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Journal Article
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung
Published in Materials chemistry and physics (01.12.2020)
Published in Materials chemistry and physics (01.12.2020)
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Journal Article
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
Chang-Chi Lee, Hung, C. P., Calvin Cheung, Ping-Feng Yang, Chin-Li Kao, Dao-Long Chen, Meng-Kai Shih, Chien-Lin Chang Chien, Yu-Hsiang Hsiao, Li-Chieh Chen, Su, Michael, Alfano, Michael, Siegel, Joe, Din, Julius, Black, Bryan
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing
Hu, Siou-Han, Lin, Ting-Chun, Kao, Chin-Li, Huang, Fei-Ya, Tsai, Yi-Yun, Hsiao, Shih-Chieh, Kuo, Jui-Chao
Published in Microelectronics and reliability (01.02.2021)
Published in Microelectronics and reliability (01.02.2021)
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Journal Article
An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications
Tsai, Min-Yan, Kao, Chin-Li, Wang, Shan-Bo, Lin, Yung-Sheng, Chiu, Meng-Chun, Liang, Chien-Lung
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Board-Level Drop Reliability Analysis for Fine-Pitch BGA Packages in Automotive Applications
Lai, Wei-Hong, Yang, Hung-Chun, Hsu, Meng-Chi, Kao, Chin-Li, Hung, C.P.
Published in 2023 IEEE CPMT Symposium Japan (ICSJ) (15.11.2023)
Published in 2023 IEEE CPMT Symposium Japan (ICSJ) (15.11.2023)
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Conference Proceeding
A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force
Wang, Chien-Yu, Chiu, Tz-Cheng, Yin, Wei-Jie, Chen, Dao-Long, Chen, Tang-Yuan, Kao, Chin-Li
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints
Lai, Yi-Shao, Kao, C.R, Chang, Hsiao-Chuan, Kao, Chin-Li
Published in Soldering & surface mount technology (26.06.2009)
Published in Soldering & surface mount technology (26.06.2009)
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Journal Article
Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate
Yuan-Ting Lin, Wei-Hong Lai, Chin-Li Kao, Jian-Wen Lou, Ping-Feng Yang, Chi-Yu Wang, Chueh-An Hseih
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging
Huang, Jeng-Hau, Shih, Po-Shao, Shen, Chang-Hsien, Renganathan, Vengudusamy, Grafner, Simon Johannes, Lin, Yu-Chun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Chiang, Chun-Wei, Kao, C.R.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System
Shih, Po-Shao, Huang, Jeng-Hau, Shen, Chang-Hsien, Lin, Yu-Chun, Grufner, Simon Johannes, Renganathan, Vengudusamy, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Chiang, Chun-Wei, Kao, C. Robert
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding