Foldable nanopaper antennas for origami electronics
Nogi, Masaya, Komoda, Natsuki, Otsuka, Kanji, Suganuma, Katsuaki
Published in Nanoscale (21.05.2013)
Published in Nanoscale (21.05.2013)
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Journal Article
Power source consideration for 56Gbps I/O interface
Ogawa, Daisuke, Fujii, Fumiaki, Hashimoto, Kaoru, Akiyama, Yutaka, Otsuka, Kanji
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
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Conference Proceeding
Printed silver nanowire antennas with low signal loss at high-frequency radio
Komoda, Natsuki, Nogi, Masaya, Suganuma, Katsuaki, Kohno, Kazuo, Akiyama, Yutaka, Otsuka, Kanji
Published in Nanoscale (21.05.2012)
Published in Nanoscale (21.05.2012)
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Journal Article
Highly Sensitive Antenna Using Inkjet Overprinting with Particle-Free Conductive Inks
Komoda, Natsuki, Nogi, Masaya, Suganuma, Katsuaki, Otsuka, Kanji
Published in ACS applied materials & interfaces (28.11.2012)
Published in ACS applied materials & interfaces (28.11.2012)
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Journal Article
All-Cu 3D Interconnects as an Alternative to Hybrid Bonding
Suga, Tadatomo, Otsuka, Kanji
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Development of Kenaf harvesting technology using a modified sugarcane harvester
Kobayashi, Y. (National Agricultural Research Center, Tsukuba, Ibaraki (Japan)), Otsuka, K, Taniwaki, K, Sugimoto, M, Kobayashi, K
Published in JARQ. Japan agricultural research quarterly (01.01.2003)
Published in JARQ. Japan agricultural research quarterly (01.01.2003)
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Journal Article
Surface Activated Bonding for Hybrid and All-Metal 3D (AM3D) Interconnect
Suga, Tadatomo, Otsuka, Kanji, Wang, Junsha
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
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Conference Proceeding
The GHz region characteristic of the BGA-printed wired board interconnection by conductive adhesives
Otsuka, Kanji, Akiyama, Yutaka
Published in Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics (01.01.2007)
Published in Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics (01.01.2007)
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Conference Proceeding
Printed silver nanowire antennas with low signal loss at high-frequency radioElectronic supplementary information (ESI) available: Operation of R/C car with a silver nanowire monopole antenna. See DOI: 10.1039/c2nr30485f
Komoda, Natsuki, Nogi, Masaya, Suganuma, Katsuaki, Kohno, Kazuo, Akiyama, Yutaka, Otsuka, Kanji
Year of Publication 21.05.2012
Year of Publication 21.05.2012
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Journal Article
Low-impedance evaluation of power distribution network for decoupling capacitor embedded interposers of 3-D integrated LSI system
Kikuchi, Katsuya, Ueda, Chihiro, Takemura, Koichi, Shimada, Osamu, Gomyo, Toshio, Takeuchi, Yukiharu, Ookubo, Toshikazu, Baba, Kazuhiro, Aoyagi, Masahiro, Sudo, Toshio, Otsuka, Kanji
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
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Conference Proceeding
How to feed enough to greedy IoT monster
Otsuka, Kanji
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Low-impedance power distribution network of decoupling capacitor embedded interposers for 3-D integrated LSI system
Kikuchi, K., Takemura, K., Ueda, C., Shimada, O., Gomyo, T., Takeuchi, Y., Okubo, T., Baba, K., Aoyagi, M., Sudo, T., Otsuka, K.
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
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Conference Proceeding