by Quach, Nhi, Kim, Ilhwan, Chang, Jong-Hyeon, Lee, ChungSun, Kang, Un-Byoung, Lee, JongHo, Won, Yoonjin
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)

by Choi, Juil, Jin, Jeongi, Kang, Gyuho, Hwang, Hyunsu, Kim, Byungchan, Yun, Hyojin, Park, Jumyong, Lee, Chungsun, Kang, Un-Byoung, Lee, Jongho
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Kang, U.-B., Kim, Y.-H.
Published in IEEE transactions on components and packaging technologies (01.06.2004)

by Kim, Min-Ki, Park, Soojeoung, Jang, Aeni, Lee, Hyuekjae, Baek, Seungduk, Lee, ChungSun, Kim, Ilhwan, Park, Jumyong, Jee, Youngkun, Kang, Un-Byoung, Kim, Dae-Woo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by Hwang, Bohee, Kim, Sanwi, Lee, Jeonghwan, Lee, Soohwan, Jee, Youngkun, Park, Sangcheon, Jo, Gyeongjae, Kim, Kwangbae, Han, Sungjin, Kim, Ilhwan, Park, Jumyong, Jung, Hyunchul, Kang, Dongwoo, Kang, Un-Byoung
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Lee, Hyunju, Park, Sung Keun, Jeong, Kwangok, Jung, Jaemok, Choi, Ju-il, Kang, Un-Byoung, Kim, Kuyoung
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Lee, Dongwon, Yoon, Soomin, Jun, Joonho, Park, Jinwoo, Lee, Teakhoon, Kang, Un-Byoung, Lee, Jongho
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Park, Se-Chul, Park, Jong-Ho, Bae, Seonghoon, Park, Junyoung, Jung, Taehwa, Yun, Hyojin, Jeong, Kwangok, Park, Seok-Bong, Choi, Ju-Il, Kang, Un-Byoung, Kang, Dongwoo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

by KANG, Un-Byoung, KIM, Young-Ho
Published in Journal of electronic materials (2004)

by KANG, Un-Byoung, KIM, Young-Ho
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)

by Hu, Fengtian, Xu, Penghui, Wang, Haozhe, Kang, Un byoung, Hu, Anmin, Li, Ming
Published in RSC advances (01.01.2015)

by Kang, Byoung Un, Jho, Jae Young, Kim, Junkyung, Lee, Sang-Soo, Park, Min, Lim, Soonho, Choe, Chul Rim
Published in Journal of applied polymer science (03.01.2001)

by Hu, Fengtian, Yang, Shan, Kang, Un byoung, Hu, Anmin, Li, Ming
Published in Journal of materials science. Materials in electronics (01.04.2016)

by Seok, Seyeong, Kang, Un-Byoung, Lee, Chungsun
Year of Publication 17.09.2024

by Un-Byoung Kang, Young-Ho Kim
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)

by KIM, Hee-Jeong, LEE, Jongho, LYU, Juhyun, KANG, Un-Byoung
Year of Publication 26.06.2024

by Un-Byoung Kang, Young-Ho Kim
Published in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002 (2002)

by LEE, Chung Sun, PARK, Jin-Woo, KANG, Un-Byoung
Year of Publication 29.02.2024

by Seok, Seyeong, Kang, Un-Byoung, Lee, Chungsun
Year of Publication 19.05.2022

by Kang, Un-Byoung, Lee, Jongho, Lyu, Juhyun, Kim, Hee-Jeong
Year of Publication 22.08.2023