Fluorescence Microscopy Methodology for Visualizing Microscale Interfacial Defects In Packaging Materials
Quach, Nhi, Kim, Ilhwan, Chang, Jong-Hyeon, Lee, ChungSun, Kang, Un-Byoung, Lee, JongHo, Won, Yoonjin
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Improving flip chip process for large 2.5D molded interposer
Lee, Dongwon, Yoon, Soomin, Jun, Joonho, Park, Jinwoo, Lee, Teakhoon, Kang, Un-Byoung, Lee, Jongho
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.01.2021)
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Conference Proceeding
Novel Approach to Highly Robust Fine Pitch RDL Process
Choi, Juil, Jin, Jeongi, Kang, Gyuho, Hwang, Hyunsu, Kim, Byungchan, Yun, Hyojin, Park, Jumyong, Lee, Chungsun, Kang, Un-Byoung, Lee, Jongho
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics
Kim, Min-Ki, Park, Soojeoung, Jang, Aeni, Lee, Hyuekjae, Baek, Seungduk, Lee, ChungSun, Kim, Ilhwan, Park, Jumyong, Jee, Youngkun, Kang, Un-Byoung, Kim, Dae-Woo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface
Hwang, Bohee, Kim, Sanwi, Lee, Jeonghwan, Lee, Soohwan, Jee, Youngkun, Park, Sangcheon, Jo, Gyeongjae, Kim, Kwangbae, Han, Sungjin, Kim, Ilhwan, Park, Jumyong, Jung, Hyunchul, Kang, Dongwoo, Kang, Un-Byoung
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan Out Panel Level Packaging (FOPLP)
Lee, Hyunju, Park, Sung Keun, Jeong, Kwangok, Jung, Jaemok, Choi, Ju-il, Kang, Un-Byoung, Kim, Kuyoung
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Realization of high A/R and fine pitch Cu pillars incorporating high speed electroplating with novel strip process
Park, Se-Chul, Park, Jong-Ho, Bae, Seonghoon, Park, Junyoung, Jung, Taehwa, Yun, Hyojin, Jeong, Kwangok, Park, Seok-Bong, Choi, Ju-Il, Kang, Un-Byoung, Kang, Dongwoo
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Superhydrophobic and anti-corrosion Cu microcones/Ni-W alloy coating fabricated by electrochemical approaches
Hu, Fengtian, Xu, Penghui, Wang, Haozhe, Kang, Un byoung, Hu, Anmin, Li, Ming
Published in RSC advances (01.01.2015)
Published in RSC advances (01.01.2015)
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Journal Article
SEMICONDUCTOR PACKAGE COATING METAL-POWDER ON SOLDER BUMP AND SEMICONDUCTOR PACKAGING METHOD
KIM, JI EUN, KANG, BYOUNG UN, LEE, JUN WOO, SEO, JOON MO, KIM, JAE HOON
Year of Publication 19.11.2010
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Year of Publication 19.11.2010
Patent
SCREEN PRINTABLE ADHESIVE PASTE FOR SEMICONDUCTOR PACKAGING
KIM, JI EUN, KANG, BYOUNG UN, LEE, JUN WOO, SEO, JOON MO, KIM, JAE HOON
Year of Publication 22.10.2010
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Year of Publication 22.10.2010
Patent
ADHESIVE FOR SEMICONDUCTOR PACKAGING WITH ION EXCHANGERS
KIM, JI EUN, KANG, BYOUNG UN, LEE, JUN WOO, SEO, JOON MO, KIM, JAE HOON
Year of Publication 22.10.2010
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Year of Publication 22.10.2010
Patent
COMPOSITION OF SEMICONDUCTOR DEVICE ATTACHING PASTE
KIM, JI EUN, KANG, BYOUNG UN, LEE, JUN WOO, SEO, JOON MO, KANG, YOUNG JU, KIM, JAE HOON
Year of Publication 07.10.2009
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Year of Publication 07.10.2009
Patent
UNDERFILL COMPOSITION ADDED BY FERRO-ELECTRIC FILLER
HYUN, SOON YOUNG, KIM, JI EUN, KANG, BYOUNG UN, SUNG, CHOONG HYUN, LEE, JUN WOO, SEO, JOON MO, KIM, JU HYUK, KIM, JAE HOON
Year of Publication 15.04.2010
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Year of Publication 15.04.2010
Patent
FILLER COMPLISING CONDUCTIVE OXIDE NANOPARTICLES AND UNDERFILL THEREOF
HYUN, SOON YOUNG, KIM, JI EUN, KANG, BYOUNG UN, SUNG, CHOONG HYUN, LEE, JUN WOO, SEO, JOON MO, KIM, JU HYUK, KIM, JAE HOON
Year of Publication 12.10.2009
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Year of Publication 12.10.2009
Patent