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"KANG, MYUNG-SAM"
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"KANG, MYUNG-SAM"
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SEMICONDUCTOR PACKAGE
by
KANG MYUNG SAM
Year of Publication
07.06.2024
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SEMICONDUCTOR PACKAGE WITH ORGANIC INTERPOSER
by
KANG MYUNG SAM
Year of Publication
12.03.2024
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Package substrate and semiconductor package including the same
by
KANG MYUNG SAM
Year of Publication
30.01.2024
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SEMICONDUCTOR PACKAGE
by
CHO BONG JU
,
KANG MYUNG SAM
Year of Publication
24.11.2022
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SEMICONDUCTOR PACKAGE
by
LEE YONG KOON
,
LEE SANG KYU
,
KANG MYUNG SAM
Year of Publication
29.12.2021
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SEMICONDUCTOR PACKAGES HAVING WIRING PATTERNS
by
CHO BONG JU
,
KIM JEONG SEOK
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
03.05.2023
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SEMICONDUCTOR PACKAGE COMPRISING HEAT DISSIPATION STRUCTURE
by
CHO BONG JU
,
KIM JEONG SEOK
,
KANG MYUNG SAM
Year of Publication
13.02.2023
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SEMICONDUCTOR PACKAGE
by
LEE YONG KOON
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
26.01.2023
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MULTILAYER PRINTED CIRCUIT BOARD
by
PARK YONG JIN
,
KANG MYUNG SAM
Year of Publication
23.05.2019
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
by
KIM JEONG SEOK
,
MUN KYUNG DON
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
27.06.2022
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SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE
by
KANG MYUNG SAM
Year of Publication
18.12.2014
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SEMICONDUCTOR PACKAGE BOARD AND METHOD FOR MAUNFACTURING THE SAME
by
KANG
,
MYUNG SAM
Year of Publication
17.12.2014
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FAN-OUT TYPE PACKAGE SUBSTRATE
by
CHO BONG JU
,
KIM JEONG SEOK
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
08.03.2022
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SEMICONDUCTOR PACKAGE
by
KIM JEONG SEOK
,
MUN KYUNG DON
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
22.02.2022
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
by
CHO BONG JU
,
KIM JEONG SEOK
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
18.01.2022
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SEMICONDUCTOR PACKAGE
by
CHO BONG JU
,
KIM JEONG SEOK
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
18.01.2022
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Semiconductor package
by
LEE YONG KOON
,
KIM JIN GU
,
LEE SANG KYU
,
KANG MYUNG SAM
Year of Publication
11.01.2022
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Semiconductor package comprising heat dissipation structure
by
PARK YONG JIN
,
LEE SEON HO
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
05.08.2021
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SEMICONDUCTOR PACKAGE
by
MUN KYUNG DON
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
13.07.2021
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SEMICONDUCTOR PACKAGE
by
MUN KYUNG DON
,
KANG MYUNG SAM
,
KO YOUNG CHAN
Year of Publication
13.07.2021
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