Prepreg, layered plate, multilayer printed wiring board, semiconductor package, and resin composition, and method of manufacturing prepreg, layered plate, and multilayer printed wiring board
TONOSAKI, SHIMA, KANEKO, TATSUNORI, SHIRAOKAWA, YOSHIKATSU, JONO, KEITA, SHIMIZU, HIROSHI, KAMOSHIDA, SHINICHI
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Year of Publication 01.10.2019
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Thermosetting resin composition, prepreg, laminate, and printed circuit board
SHIRAOKAWA, YOSHIKATSU, KANEKO, TATSUNORI, YANAGIDA, MAKOTO, KAKITANI, MINORU, KUSHIDA, KEISUKE
Year of Publication 01.03.2017
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Year of Publication 01.03.2017
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