14nm BEOL TDDB reliability testing and defect analysis
Kane, Terence
Published in Proceedings of the 2015 International Conference on Microelectronic Test Structures (01.03.2015)
Published in Proceedings of the 2015 International Conference on Microelectronic Test Structures (01.03.2015)
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Conference Proceeding
Journal Article
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
Nogami, Takeshi, Briggs, Benjamin D., Korkmaz, Sevim, Chae, Moosung, Penny, Christopher, Juntao Li, Wei Wang, McLaughlin, Paul S., Kane, Terence, Parks, Christopher, Madan, Anita, Cohen, Stephan, Shaw, Thomas, Priyadarshini, Deepika, Shobha, Hosadurga, Son Nguyen, Patlolla, Raghuveer, Kelly, James, Xunyuan Zhang, Spooner, Terry, Canaperi, Donald, Standaert, Theodorus, Huang, Elbert, Paruchuri, Vamsi, Edelstein, Daniel
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
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Conference Proceeding
Journal Article
The salinity signature of the equatorial Pacific cold tongue as revealed by the satellite SMOS mission
Maes, Christophe, Reul, Nicolas, Behringer, David, O’Kane, Terence
Published in Geoscience letters (31.12.2014)
Published in Geoscience letters (31.12.2014)
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Journal Article
Nano CV probe characterization analysis comparison with conventional CV probe pad analysis
Kane, T., Tenney, M. P.
Published in 2012 IEEE International Conference on Microelectronic Test Structures (01.03.2012)
Published in 2012 IEEE International Conference on Microelectronic Test Structures (01.03.2012)
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Conference Proceeding
Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues
Fen Chen, Mittl, S., Shinosky, M., Swift, A., Kontra, R., Anderson, B., Aitken, J., Yanfeng Wang, Kinser, E., Kumar, M., Yun Wang, Kane, T., Feng, Kai D., Henson, W. K., Mocuta, D., Di-an Li
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
Electromigration-resistance enhancement with CoWP or CuMn for advanced Cu interconnects
Christiansen, C, Baozhen Li, Angyal, M, Kane, T, McGahay, V, Yun Yu Wang, Shaoning Yao
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
Geometry, kinetics, and short length effects of electromigration in Mn doped Cu interconnects at the 32nm technology node
Christiansen, C., Baozhen Li, Angyal, M., Kane, T., McGahay, V., Yun Yu Wang, Shaoning Yao
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding
300mm wafer Atomic force probe characterization methodology
Kane, T
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
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Conference Proceeding