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Year of Publication 18.01.2017
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Year of Publication 18.01.2017
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METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBEDDED DIE PACKAGES
OKA MIHIR A, KANAOKA YOSUKE, XU DINGYING, MANEPALLI RAHUL N, VORONOV SERGEI L, SUN DONG HAI
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Year of Publication 01.07.2014
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Die Embedding Challenges for EMIB Advanced Packaging Technology
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Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Year of Publication 23.03.2023
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Embedded die microelectronic device with molded component
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Year of Publication 10.09.2024
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PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES
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Year of Publication 04.07.2024
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DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTOR DIE PLACEMENT
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Year of Publication 19.09.2024
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Year of Publication 19.09.2024
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FIDUCIAL FOR AN ELECTRONIC DEVICE
Kanaoka, Yosuke, Medhi, Gautam, Chen, Huang-Ta, Mcree, Robin, Duan, Gang
Year of Publication 26.07.2023
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Year of Publication 26.07.2023
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OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
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Year of Publication 30.05.2024
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Year of Publication 30.05.2024
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FIDUCIAL FOR AN ELECTRONIC DEVICE
Kanaoka, Yosuke, Medhi, Gautam, Chen, Huang-Ta, Mcree, Robin, Duan, Gang
Year of Publication 23.03.2023
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Year of Publication 23.03.2023
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FIDUCIAL FOR AN ELECTRONIC DEVICE
Kanaoka, Yosuke, Medhi, Gautam, Chen, Huang-Ta, Mcree, Robin, Duan, Gang
Year of Publication 22.03.2023
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Year of Publication 22.03.2023
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DEVICES AND METHODS TO MINIMIZE DIE SHIFT IN EMBEDDED HETEROGENEOUS ARCHITECTURES
Kanaoka, Yosuke, Mcree, Robin, Gosselin, Timothy A, Duan, Gang, Liu, Jinhe
Year of Publication 16.03.2023
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Year of Publication 16.03.2023
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MINIMIZING DIE SHIFT IN EMBEDDED HETEROGENEOUS ARCHITECTURES
GOSSELIN, Timothy A, LIU, Jinhe, KANAOKA, Yosuke, DUAN, Gang, MCREE, Robin
Year of Publication 15.03.2023
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Year of Publication 15.03.2023
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DIRECTLY COUPLED OPTICAL INTERPOSER
Ye, Duye, Tanaka, Hiroki, May, Robert A, Darmawikarta, Kristof, Liu, Changhua, McRee, Robin, Seshadri, Shriya, May, Lilia, Zhang, Zhichao, Kanaoka, Yosuke, Pietambaram, Srinivas, Nie, Bai, Ibrahim, Tarek
Year of Publication 04.04.2024
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Year of Publication 04.04.2024
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EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
Kanaoka, Yosuke, Pietambaram, Srinivas Venkata Ramanuja, Seneviratne, Dilan, Akkinepally, Praneeth, Jones, Jesse C, Manepalli, Rahul N
Year of Publication 25.11.2021
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Year of Publication 25.11.2021
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