Constant field stressing of via-to-line spacing for accurate projection of intrinsic TDDB lifetime
Kamoshima, T., Makabe, K., Amishiro, M., Furusawa, T., Takata, Y., Ogasawara, M.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
Controlling Ambient Gas in Slot-to-Slot Space Inside FOUP to Suppress Cu-Loss After Dual Damascene Patterning : Maximizing operational efficiencies at the leading edge
KAMOSHIMA, Takao, FUJII, Yasuhisa, NOGUCHI, Toshimitsu, SAEKI, Tomonori, TAKATA, Yoshifumi, OCHI, Hironori, KOIWA, Akira
Published in IEEE transactions on semiconductor manufacturing (2008)
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Published in IEEE transactions on semiconductor manufacturing (2008)
Conference Proceeding
Ambient gas control in slot-to-slot space inside FOUP to suppress Cu-loss after dual damascene patterning
Kamoshima, T., Fujii, Y., Noguchi, T., Saeki, T., Takata, Y., Ochi, H., Koiwa, A.
Published in 2007 International Symposium on Semiconductor Manufacturing (01.10.2007)
Published in 2007 International Symposium on Semiconductor Manufacturing (01.10.2007)
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Conference Proceeding