Stiffener and package substrate for a semiconductor package
Mason, Cory, Han, Dong-Ho, Kamisetty, Kirankumar, Zamani, M. Reza, Aygun, Kemal, Ganguly, Konika, Christianson, Stephen, Hall, Stephen, Davies-Venn, Emile, Liao, Jun
Year of Publication 05.04.2022
Get full text
Year of Publication 05.04.2022
Patent
STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE
CHRISTIANSON, Stephen, HALL, Stephen, LIAO, Jun, DAVIES-VENN, Emile, GANGULY, Konika, ZAMANI, M. Reza, HAN, Dong-Ho, KAMISETTY, Kirankumar, AYGUN, Kemal, MASON, Cory
Year of Publication 10.10.2019
Get full text
Year of Publication 10.10.2019
Patent