Search Results - "KAKIYA MINORU" :: K.UTB vyhledávací portál

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MULTILAYER TRANSMISSION LINE PLATE AND SEMICONDUCTOR PACKAGE

by MIZUSHIMA ETSUO, KAKIYA MINORU, KOBAYASHI YUZURU
Year of Publication 15.01.2024

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MULTILAYER TRANSMISSION LINE PLATE AND SEMICONDUCTOR PACKAGE

by MIZUSHIMA ETSUO, KAKIYA MINORU, KOBAYASHI YUZURU
Year of Publication 15.01.2024

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THERMOSETTING RESIN COMPOSITION, RESIN FILM, PREPREG, LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE AND COMMUNICATION DEVICE

by KAKIYA MINORU, MORITA KOJI, HAYASHI CHIHIRO, KASUGA KEIICHI
Year of Publication 01.07.2024

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RESIN COMPOSITION, RESIN-LAYER PROVIDED SUPPORT, PREPREG, LAMINATE SHEET, MULTILAYER PRINTED WIRING BOARD AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR

by KAKIYA MINORU, MORITA KOJI, IRINO TETSURO, TANIGAWA TAKAO
Year of Publication 28.06.2024

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RESIN COMPOSITION, LAMINATE SHEET, MULTILAYER PRINTED WIRING BOARD, RESIN FILM, AND PREPREG

by KAKIYA MINORU, MORITA KOJI, IRINO TETSURO, TANIGAWA TAKAO
Year of Publication 31.05.2024

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METHOD FOR MANUFACTURING PREPREG, PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

by KANEKO TATSUNORI, KAKIYA MINORU, SHIRAOKAWA YOSHIKATSU, SHIMIZU HIROSHI, KUSHIDA KEISUKE
Year of Publication 24.05.2024

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RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, ANTENNA DEVICE AND ANTENNA MODULE

by KAKIYA MINORU, MORITA KOJI, HAYASHI CHIHIRO, KASUGA KEIICHI
Year of Publication 01.12.2023

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RESIN COMPOSITION, PREPREG, RESIN FILM, METALLIC FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

by MURATA YUTA, KAKIYA MINORU, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, TANIGAWA TAKAO
Year of Publication 09.04.2024

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THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

by MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, TANIGAWA TAKAO
Year of Publication 26.10.2023

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RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

by MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, AKEBI RYUJI, FUKUI MASATO, TANIGAWA TAKAO
Year of Publication 26.10.2023

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THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION-COMPATIBLE MODULE

by SHIMADA TOMOKAZU, KAKIYA MINORU, DANSEIGEN KAZUTOSHI, TONAI SHUNSUKE, FUKUDA TOMIO
Year of Publication 02.12.2021

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RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING RESIN COMPOSITION AND RESIN

by KAKIYA MINORU, HORIE AKIRA, TAKEGUCHI AYAKA, SATO NAOYOSHI, AKEBI RYUJI, AITSU SHUJI, TANIGAWA TAKAO
Year of Publication 28.07.2023

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FLUORINE RESIN SUBSTRATE LAMINATE

by MURAI KOSUKE, KAKIYA MINORU, YANAGIDA MAKOTO, SHIMADA MAMI, TANIGAWA TAKAO
Year of Publication 06.05.2021

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THERMOSETTING RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

by KANEKO TATSUNORI, KAKIYA MINORU, SHIRAOKAWA YOSHIKATSU, KUSHIDA KEISUKE
Year of Publication 04.02.2021

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THERMOSETTING RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

by KAKIYA MINORU, YOSHIDA KAORI, KUSHIDA KEISUKE, TOMIOKA KENICHI
Year of Publication 03.12.2020

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THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

by MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, OTSUKA KOHEI, TANIGAWA TAKAO
Year of Publication 05.07.2023

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