Method of manufacturing a semiconductor device
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Year of Publication 19.05.2010
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Year of Publication 19.05.2010
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A device support, and a handler including the device support
YOKOO, MASAYOSHI, HARADA, KEITARO, KAINUMA, NORIKAZU, YOSHIDA, KOICHI
Year of Publication 01.05.2007
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Year of Publication 01.05.2007
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Guide wire and stent
ISHIDA KIYOHITO, SOUBA RYOUICHI, SUTOU YUJI, OMORI TOSHIHIRO, MURAYAMA HIRAKU, KAINUMA RYOSUKE, TANAKA YUUKI, YAMAUCHI KIYOSHI
Year of Publication 17.03.2010
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Year of Publication 17.03.2010
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Method of flip-chip mounting a semiconductor chip and mounting apparatus using the same
KAINUMA, NORIO, NAKAMURA, KIMIO, MATSUMURA, TAKAYOSHI, KOBAE, KENJI, KIRA, HIDEHIKO
Year of Publication 16.05.2006
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Year of Publication 16.05.2006
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Method of manufacturing a semiconductor device
KAINUMA, NORIO, NAKAMURA, KIMIO, ISHIKAWA, KUNIKO, KOBAE, KENJI, OZAKI, YUKIO, KIRA, HIDEHIKO
Year of Publication 16.12.2007
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Year of Publication 16.12.2007
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Semiconductor device and method of manufacturing integrated circuit chip
YAMAKAMI TAKATOYO, KOBAE KENJI, KOBAYASHI HIROSHI, KIRA HIDEHIKO, KAINUMA NORIO, OKADA TORU, SASAKI YASUNORI, BABA SHUNJI, KOMIYAMA TAKESHI
Year of Publication 08.04.2009
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Year of Publication 08.04.2009
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Semiconductor parts and method for manufacturing integrate circuit chip
YAMAKAMI TAKATOYO, KOBAE KENJI, KOBAYASHI HIROSHI, KIRA HIDEHIKO, KAINUMA NORIO, OKADA TORU, SASAKI YASUNORI, BABA SHUNJI, KOMIYAMA TAKESHI
Year of Publication 13.08.2008
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Year of Publication 13.08.2008
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Electro-pneumatic air pressure regulator
HAYASHI, AKIHIRO, AOKI, TOSHIKAZU, UEMATSU, KATSUO, TAMAKI, KEIJI, KAINUMA, MASAKUNI, NAKANISHI, MITSUAKI, CHINDA, HIROSHI, FUJITA, TOMOMASA
Year of Publication 01.03.2005
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Year of Publication 01.03.2005
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ELECTRO-PNEUMATIC AIR PRESSURE REGULATOR HAVING HIGHLY-IMPROVED RESOLVING POWER BY REDUCING AIR FLOW PATH AREA DETERMINED BY CONICAL PROJECTION AND CONICAL RECESS
HAYASHI, AKIHIRO, AOKI, TOSHIKAZU, UEMATSU, KATSUO, TAMAKI, KEIJI, KAINUMA, MASAKUNI, NAKANISHI, MITSUAKI, CHINDA, HIROSHI, FUJITA, TOMOMASA
Year of Publication 13.12.2004
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Year of Publication 13.12.2004
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Method of bonding electronic component and bonding apparatus used for the same
KAINUMA, NORIO, TAKAYOSHI MATSUMURA, KOBAE, KENJI, KIRA, HIDEHIKO, TAKEUCHI, SHUICHI, KOBAYASHI, HIROSHI
Year of Publication 01.08.2004
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Year of Publication 01.08.2004
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Automatic inspection apparatus for semiconductor device and method therefor
KAINUMA, TADASHI, KOJIMA, KATSUMI, BANNAI, KUNIAKI, ONISHI, TAKESHI, YAMADA, NARUHITO
Year of Publication 01.06.1999
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Year of Publication 01.06.1999
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OPTICAL INFORMATION PROCESSING APPARATUS
KANDO, HIDEHIKO, MURANISHI, MASARU, KAINUMA, MAMORU, KATSUHIKO, KIMURA
Year of Publication 05.02.1997
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Year of Publication 05.02.1997
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HIGH ABRASION RESISTANT ALUMINUM BRONZE ALLOY AND SLIDING MEMBERS USING SAME
SUWA, MASATERU, SAKAKURA, MASARU, KOMURO, KATSUHIRO, BABA, NOBORU, CHIKAZAKI, MITSUO, KAINUMA, MASAYOSHI, KUMAGAI, YOZO
Year of Publication 01.06.2000
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Year of Publication 01.06.2000
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METHOD AND APPARATUS FOR AUTOMATIC INSPECTION OF SEMICONDUCTOR DEVICE
KAINUMA, TADASHI, TANAKA, YAMADA, KOJIMA, KATSUMI, BANNAI, KUNIAKI, ONISHI, TAKESHI, YAMADA, NARUHITO
Year of Publication 01.07.1999
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Year of Publication 01.07.1999
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