Texture and Grain Size Investigation in the Copper Plated Through-Silicon via for Three-Dimensional Chip Stacking Using Electron Backscattering Diffraction
Kadota, Hiroyuki, Kanno, Ryuichi, Ito, Masahiko, Onuki, Jin
Published in Electrochemical and solid-state letters (2011)
Published in Electrochemical and solid-state letters (2011)
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Journal Article
Investigation on microstructure and resistivity in Cu-TSVs for 3D packaging
Satoh, Akira, Kadota, Hiroyuki, Inami, Takashi, Itou, Masahiko, Onuki, Jin
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Risk factors for intraoperative perforation during endoscopic submucosal dissection of superficial esophageal squamous cell carcinoma
Noguchi, Masaaki, Yano, Tomonori, Kato, Tomoji, Kadota, Tomohiro, Imajoh, Maomi, Morimoto, Hiroyuki, Osera, Shozo, Yagishita, Atsushi, Odagaki, Tomoyuki, Yoda, Yusuke, Oono, Yasuhiro, Ikematsu, Hiroaki, Kaneko, Kazuhiro
Published in World journal of gastroenterology : WJG (21.01.2017)
Published in World journal of gastroenterology : WJG (21.01.2017)
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Journal Article