Nitrogen infusion R&D at DESY a case study on cavity cut-outs
Wenskat, Marc, Bate, Christopher, Dangwal Pandey, Arti, Jeromin, Arno, Keller, Thomas F, Knobloch, Jens, Köszegi, Julia, Kramer, Felix, Kugeler, Oliver, Kulkarni, Satish, Reschke, Detlef, Schaffran, Jörn, Dalla Lana Semione, Guilherme, Sievers, Sven, Steder, Lea, Stierle, Andreas, Walker, Nicholas
Published in Superconductor science & technology (01.11.2020)
Published in Superconductor science & technology (01.11.2020)
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Journal Article
High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications
Chernobryvko, Mykola, Kaiser, Michael P., Murugesan, Kavin Senthil, Kuylenstierna, Dan, Koszegi, Julia-Marie, Gernhardt, Robert, Braun, Tanja, Ndip, Ivan, Schneider-Ramelow, Martin
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
The Impact of Ageing on the Dielectric Properties of Laminates for 79 GHz Automotive Radar
Koszegi, Julia-Marie, Rossi, Marco, Wittler, Olaf, Walter, Hans, Schwanitz, Oliver, Ndip, Ivan, Lang, Klaus-Dieter, Schneider-Ramelow, Martin
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Unlocking the True Power of Additive Manufacturing for EMI Shielding
Scheibel, Markus G., Kaiser, Michael P., Balasubramaniam, Sutharsan, Chernobryvko, Mykola, Koszegi, Julia-Marie, Dreissigacker, Marc, Adler, Marius, Braun, Tanja, Huang, Chuan I. Eric, Li, Meng Jason, Thomas, Muriel, Vollmann, Franz
Published in Journal of microelectronics and electronic packaging (01.04.2024)
Published in Journal of microelectronics and electronic packaging (01.04.2024)
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Journal Article
A Comparative Analysis of Two Dielectric Extraction Methods of a PCB Material for D-Band Applications
Kanitkar, Abhijeet, Ndip, Ivan, Chernobryvko, Mykola, Koszegi, Julia-Marie, Schwanitz, Oliver, Schneider-Ramelow, Martin
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Split-rings for heterogeneous integration of mm-Wave systems
Koszegi, Julia-Marie, Schnelle, Lars, Jia, Xingdan, Schwanitz, Oliver, Ndip, Ivan, Schneider-Ramelow, Martin, Lang, Klaus-Dieter
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
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Conference Proceeding
Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies
Walter, Hans, Wittler, Olaf, Van Dijk, Marius, Huber, Saskia, Julia-Marie-Koszegi, Schneider-Ramelow, Martin
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding