Towards the Automation of Non-destructive Fault Recognition: Enhancement of Robustness and Accuracy Through AI Powered Acoustic and Thermal Signal Analysis in Time, Frequency- and Time-Frequency Domains
Brand, Sebastian, Altmann, Frank, Grosse, Christian, Kögel, Michael, Hollerith, Christian, Gounet, Pascal
Published in Journal of failure analysis and prevention (01.10.2024)
Published in Journal of failure analysis and prevention (01.10.2024)
Get full text
Journal Article
Assessing and Mitigating Ice-Jam Flood Hazards and Risks: A European Perspective
Lindenschmidt, Karl-Erich, Alfredsen, Knut, Carstensen, Dirk, Choryński, Adam, Gustafsson, David, Halicki, Michał, Hentschel, Bernd, Karjalainen, Niina, Kögel, Michael, Kolerski, Tomasz, Kornaś-Dynia, Marika, Kubicki, Michał, Kundzewicz, Zbigniew W., Lauschke, Cornelia, Malinger, Albert, Marszelewski, Włodzimierz, Möldner, Fabian, Näslund-Landenmark, Barbro, Niedzielski, Tomasz, Parjanne, Antti, Pawłowski, Bogusław, Pińskwar, Iwona, Remisz, Joanna, Renner, Maik, Roers, Michael, Rybacki, Maksymilian, Szałkiewicz, Ewelina, Szydłowski, Michał, Walusiak, Grzegorz, Witek, Matylda, Zagata, Mateusz, Zdralewicz, Maciej
Published in Water (Basel) (01.01.2023)
Published in Water (Basel) (01.01.2023)
Get full text
Journal Article
Development of an Ice Jam Flood Forecasting System for the Lower Oder River—Requirements for Real-Time Predictions of Water, Ice and Sediment Transport
Lindenschmidt, Karl-Erich, Carstensen, Dirk, Fröhlich, Wolfgang, Hentschel, Bernd, Iwicki, Stefan, Kögel, Michael, Kubicki, Michał, Kundzewicz, Zbigniew W., Lauschke, Cornelia, Łazarów, Adam, Łoś, Helena, Marszelewski, Włodzimierz, Niedzielski, Tomasz, Nowak, Marcin, Pawłowski, Bogusław, Roers, Michael, Schlaffer, Stefan, Weintrit, Beata
Published in Water (Basel) (08.01.2019)
Published in Water (Basel) (08.01.2019)
Get full text
Journal Article
Lock-in Thermography for the Localization of Security Hard Blocks on SoC Devices
Kögel, Michael, Brand, Sebastian, Große, Christian, Altmann, Frank, Selmke, Bodo, Zinnecker, Kilian, Hesselbarth, Robert, Jacob Kabakci, Nisha
Published in Journal of failure analysis and prevention (01.10.2024)
Published in Journal of failure analysis and prevention (01.10.2024)
Get full text
Journal Article
Combination of close-range and aerial photogrammetry with terrestrial laser scanning to answer microbiological and climatological questions in connection with lava caves
Kögel, Michael, Pflitsch, Andreas, Northup, Diana E., Carstensen, Dirk, Medley, Joseph J., Mansheim, Teresa, Killing, Thomas, Buschbacher, Michael, Angerer, Helena, Falkner, Julian, Kynatidis, Achilleas, Ott, Valentin, Regler, Simon
Published in Applied geomatics (01.12.2022)
Published in Applied geomatics (01.12.2022)
Get full text
Journal Article
Non-destructive Assessment of the Porosity in Silver (Ag) Sinter Joints Using Acoustic Waves
Brand, Sebastian, Bottge, Bianca, Kogel, Michael, Naumann, Falk, Zijl, Jurrian, Kersjes, Sebastiaan, Behrens, Thomas, Altmann, Frank
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Get full text
Conference Proceeding
SOCKET FALLING PREVENTION DEVICE FOR IMPACT TOOL
LUDWIG, Wolfgang, TAN, Kit Siang, KÖGEL, Michael, HARTMANN, Markus, WALTER, Henrik
Year of Publication 30.05.2024
Get full text
Year of Publication 30.05.2024
Patent
SOCKET FALLING PREVENTION DEVICE FOR IMPACT TOOL
Walter, Henrik, Kögel, Michael, Ludwig, Wolfgang, Hartmann, Markus, Tan, Kit Siang
Year of Publication 29.05.2024
Get full text
Year of Publication 29.05.2024
Patent
Advances in High-Resolution Non-Destructive Defect Detection and Localization Enhanced by Intelligent Signal Processing
Brand, Sebastian, Kogel, Michael, Grosse, Christian, Gounet, Pascal, Hollerith, Christian, Altmann, Frank
Published in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.07.2024)
Published in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.07.2024)
Get full text
Conference Proceeding
Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration
Tiwary, Nikhilendu, Grosse, Christian, Kogel, Michael, Windemuth, Thilo, Ross, Glenn, Vuorinen, Vesa, Brand, Sebastian, Paulasto-Krockel, Mervi
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11.09.2024)
Get full text
Conference Proceeding
High Resolution Acoustic GHz Microscopy
Brand, Sebastian, Kögel, Michael, Altmann, Frank
Published in Electronic device failure analysis (01.11.2018)
Published in Electronic device failure analysis (01.11.2018)
Get full text
Magazine Article