Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
Jurenka, C., Jon Yeon Kim, Wolf, M.J., Engelmann, G., Ehrmann, O., Jin Yu, Reichl, H.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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