Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
Yanggyoo Jung, Dongsu Ryu, Minho Gim, Choonghoe Kim, Yunseok Song, Jinyoung Kim, Juhoon Yoon, Choonheung Lee
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Development of large die fine pitch flip chip BGA using TCNCP technology
Yanggyoo Jung, Minjae Lee, Sunwoo Park, Dongsu Ryu, Youshin Jung, Chanha Hwang, Choonheung Lee, Sungsoon Park, Jimarez, M., Myung-June Lee
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Semiconductor package having an interposer and method of manufacturing semiconductor package
Jung, Yanggyoo, Kang, Jinhyun, Yong, Sangmin, Ryu, Seungkwan, Kim, Sungeun
Year of Publication 25.06.2024
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Year of Publication 25.06.2024
Patent
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
KANG, JINHYUN, YONG, SANGMIN, KIM, SUNGEUN, RYU, SEUNGKWAN, JUNG, YANGGYOO
Year of Publication 12.10.2023
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Year of Publication 12.10.2023
Patent
Semiconductor package having an interposer and method of manufacturing semiconductor package
Jung, Yanggyoo, Kang, Jinhyun, Yong, Sangmin, Ryu, Seungkwan, Kim, Sungeun
Year of Publication 04.07.2023
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Year of Publication 04.07.2023
Patent
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Jung, Yanggyoo, Kang, Jinhyun, Yong, Sangmin, Ryu, Seungkwan, Kim, Sungeun
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
Patent