Novel Maskless Bumping for 3D Integration
Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung
Published in ETRI journal (01.04.2010)
Published in ETRI journal (01.04.2010)
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Journal Article
Compact wound-type slot antenna with wide bandwidth
HWANG, Junghwan, JUNG, Sunghae, KANG, Sungweon, KIM, Yountae
Published in IEEE microwave and wireless components letters (01.12.2004)
Published in IEEE microwave and wireless components letters (01.12.2004)
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Journal Article
A Bidirectional Readout Integrated Circuit (ROIC) with Capacitance-to-Time Conversion Operation for High Performance Capacitive MEMS Accelerometers
Sungsik Lee, Myunglae Lee, Sunghae Jung, Changhan Je, Jiman Park, Gunn Hwang, Changauck Choi
Published in 2007 IEEE Sensors (01.10.2007)
Published in 2007 IEEE Sensors (01.10.2007)
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Conference Proceeding
Sensitivity tunable capacitive type micro accelerometer
Chang Han Je, Sungsik Lee, Myung Lae Lee, Sunghae Jung, Lee, A., Gunn Hwang, Byoung Gon Yu, Chang Auck Choi
Published in 2008 IEEE Sensors (01.10.2008)
Published in 2008 IEEE Sensors (01.10.2008)
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Conference Proceeding
RF MEMS wafer-level packaging using solder paste by via filling process
Sunghae Jung, Myunglae Lee, Jong-Tae Moon
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Optimized TSV process using bottom-up electroplating without wafer cracks
Byeong-Ok Lim, Kwang-Seong Choi, Yong-Sung Eom, Hyun-Cheol Bae, Sunghae Jung, Ki-Jun Sung, Jong-Tae Moon
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
3D SiP module using TSV and novel solder bump maker
Hyun-Cheol Bae, Kwang-Seong Choi, Yong-Sung Eom, Byeong-Ok Lim, Ki-Jun Sung, Sunghae Jung, Byeung-Gee Kim, In-Soo Kang, Jong-Tae Moon
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Novel bumping material for stacking silicon chips
Kwang-Seong Choi, Ki-Jun Sung, Byeong-Ok Lim, Hyun-Cheol Bae, Sunghae Jung, Jong Tae Moon, Yong Sung Eom
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Chip scale packaging with surface mountable solder ball terminals for microsensors
Ahra Lee, SangChul Lee, Sungsik Lee, Chang Han Je, Sunghae Jung, Myoung-Lae Lee, Gunn Hwang, Byoung-Gon Yu, Chang Auck Choi
Published in 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.01.2009)
Published in 2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.01.2009)
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Conference Proceeding
Compact wound-type slot antenna with wide bandwidth
HWANG, Junghwan, JUNG, Sunghae, KANG, Sungweon, KIM, Yountae
Published in IEEE Antennas and Propagation Society Symposium, 2004 (2004)
Published in IEEE Antennas and Propagation Society Symposium, 2004 (2004)
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Conference Proceeding
Design, Fabrication, and Characterization of a Readout Integrated Circuit (ROIC) for Capacitive MEMS Sensors
Lee, Myung Lae, Lee, Sung Sik, Jung, Sung Hae, Je, Chang Han, Hwang, Gunn, Choi, Chang Auck
Published in 2007 IEEE Sensors (01.10.2007)
Published in 2007 IEEE Sensors (01.10.2007)
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Conference Proceeding
DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
CHU MOO JUNG, LEE JONG-HYUN, JUN DONG SUK, BAE HYUNOL, MOON JONG TAE, JUNG SUNGHAE
Year of Publication 19.05.2011
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Year of Publication 19.05.2011
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