Low Temperature, Wafer Level Au-In Bonding for ISM Packaging
Qian Wang, Kyudong Jung, Minseog Choi, Woonbae Kim, Sukjin Ham, Byunggil Jeong, Changyoul Moon
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging
KIM, Woonbae, QIAN WANG, JUNG, Kyudong, HWANG, Junsik, MOON, Changyoul
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
Published in 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings (2004)
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Conference Proceeding
A low temperature, hermetic wafer level packaging method for RF MEMS switch
Woonbae Kim, Qian Wang, Junsik Hwang, Moonchul Lee, Kyudong Jung, SukJin Ham, Changyoul Moon, Kyedong Baeks, Byeoungju Ha, Insang Song
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Security Considerations for In-Vehicle Secure Communication
Ju, Hongil, Jeon, BooSun, Kim, Daewon, Jung, Boheung, Jung, Kyudong
Published in 2019 International Conference on Information and Communication Technology Convergence (ICTC) (01.10.2019)
Published in 2019 International Conference on Information and Communication Technology Convergence (ICTC) (01.10.2019)
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Conference Proceeding