Age-dependent modulation of the extracellular microenvironment of human adipose-derived stem cells
Hamel, K.M, Gimble, J, Jung, J.P, Martin, E.C
Published in Cytotherapy (Oxford, England) (01.05.2018)
Published in Cytotherapy (Oxford, England) (01.05.2018)
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Use of Pericholedochal Plexus for Portal Flow Reconstruction in Diffuse Portal Vein Thrombosis: Case Report
Lee, S, Kim, D.J, Kim, I.-G, Jeon, J.Y, Jung, J.P, Choi, G.-S, Kim, J.S
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Characteristics of Sn-Cu Solder Bump Formed by Electroplating for Flip Chip
Jung, S.W., Jung, J.P., Zhou, Y.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2006)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2006)
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243 - Age-dependent modulation of the extracellular microenvironment of human adipose-derived stem cells
Hamel, K.M., Gimble, J., Jung, J.P., Martin, E.C.
Published in Cytotherapy (Oxford, England) (01.05.2018)
Published in Cytotherapy (Oxford, England) (01.05.2018)
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Video review of surgeon technical factors of the hepaticojejunostomy independently predicts postoperative biliary complications after pancreaticoduodenectomy
Brown, J.A., Jung, J.P., Zenati, M., Al-Abbas, A.I., Hogg, M.E., Zeh, H.J., Zureikat, A.H.
Published in HPB (Oxford, England) (01.03.2019)
Published in HPB (Oxford, England) (01.03.2019)
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Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints
Bang, W.H., Moon, M.-W., Kim, C.-U., Kang, S.H., Jung, J.P., Oh, K.H.
Published in Journal of electronic materials (01.04.2008)
Published in Journal of electronic materials (01.04.2008)
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Do Revenues Matter More Than Earnings for Initial Public Offerings?
Massel, Norman, Park, Jung Eun “JP”, Reichelt, Kenneth J.
Published in Journal of accounting, auditing & finance (01.01.2024)
Published in Journal of accounting, auditing & finance (01.01.2024)
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Experimental study of ultrasonic wedge bonding with copper wire
Tian, Y.H., Lum, I., Won, S.J., Park, S.H., Jung, J.P., Mayer, M., Zhou, Y.
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
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