Dual face package having resin insulating layer
MOON SEON HEE, KWEON YOUNG DO, HONG JU PYO, LEE JAE KWANG, PARK SEUNG WOOK, YUAN JINGLI
Year of Publication 10.01.2012
Get full text
Year of Publication 10.01.2012
Patent
Power semiconductor module and method of manufacturing the same
JANG BUM SIK, PARK JI HYUN, KIM TAE HYUN, HONG JU PYO, GAO SHAN, CHOI SEOG MOON
Year of Publication 15.11.2011
Get full text
Year of Publication 15.11.2011
Patent
METHOD OF PACKAGING WAFER LEVEL PACKAGE WITH MARKING LAYER
PARK, SEUNG WOOK, KIM, TAE HOON, GAO SHAN, HONG, JU PYO, CHOI, SEOG MOON
Year of Publication 07.11.2008
Get full text
Year of Publication 07.11.2008
Patent
Semiconductor chip package and method of manufacturing the same
KWEON YOUNG DO, JEON EUN KYUNG, LEE HEE KON, HONG JU PYO, KIM JIN GU, PARK SEUNG WOOK
Year of Publication 18.08.2011
Get full text
Year of Publication 18.08.2011
Patent
WAFER LEVEL CHIP SCALE PACKAGE AND FABRICATING METHOD OF THE SAME
KWEON YOUNG DO, PARK, SEUNG WOOK, BAEK, JONG HWAN, GAO SHAN, HONG, JU PYO, YUAN JINGLI
Year of Publication 16.02.2010
Get full text
Year of Publication 16.02.2010
Patent
PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
KWEON YOUNG DO, LEE HEE KON, HONG JU PYO, KIM JIN GU, PARK SEUNG WOOK
Year of Publication 30.06.2011
Get full text
Year of Publication 30.06.2011
Patent
Method of manufacturing a dual face package
MOON SEON HEE, KWEON YOUNG DO, HONG JU PYO, LEE JAE KWANG, PARK SEUNG WOOK, YUAN JINGLI
Year of Publication 02.06.2011
Get full text
Year of Publication 02.06.2011
Patent
WAFER LEVEL CHIP SCALE PACKAGE AND FABRICATING METHOD OF THE SAME
JANG, BUM SIK, PARK, SEUNG WOOK, GAO SHAN, KIM, JONG WOON, HONG, JU PYO, CHOI, SEOG MOON
Year of Publication 13.01.2010
Get full text
Year of Publication 13.01.2010
Patent
WAFER LEVEL CHIP SCALE PACKAGE AND FABRICATING METHOD OF THE SAME
JANG, BUM SIK, PARK, SEUNG WOOK, GAO SHAN, KIM, JONG WOON, HONG, JU PYO, CHOI, SEOG MOON
Year of Publication 06.01.2010
Get full text
Year of Publication 06.01.2010
Patent
WAFER LEVEL CHIP SCALE PACKAGE AND FABRICATING METHOD OF THE SAME
KWEON YOUNG DO, PARK, SEUNG WOOK, BAEK, JONG HWAN, GAO SHAN, HONG, JU PYO, YUAN JINGLI
Year of Publication 24.11.2009
Get full text
Year of Publication 24.11.2009
Patent
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
JANG BUM SIK, PARK JI HYUN, KIM TAE HYUN, HONG JU PYO, GAO SHAN, CHOI SEOG MOON
Year of Publication 20.01.2011
Get full text
Year of Publication 20.01.2011
Patent
A WAFER LEVEL DEVICE PACKAGE HAVING A SEAL LINE
PARK, SEUNG WOOK, KIM, TAE HOON, GAO SHAN, HONG, JU PYO, CHOI, SEOG MOON
Year of Publication 02.01.2008
Get full text
Year of Publication 02.01.2008
Patent
WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
KIM, DAE JUN, PARK, SEUNG WOOK, CHOI, CHUN, YANG, SI JOONG, HONG, JU PYO
Year of Publication 01.04.2009
Get full text
Year of Publication 01.04.2009
Patent
REAGENT VESSEL
BAE BYEONG-WOO, YOO JAE-HYUN, KIM HYOUNG-SOO, LEE SUNG-DONG, HONG JU-PYO, KIM MIN-SUN, PARK HEON-SEOK
Year of Publication 05.08.2010
Get full text
Year of Publication 05.08.2010
Patent
SINGLE WAFER LEVEL DEVICE PACKAGE AND METHOD OF PACKAGING THE SAME
PARK, SEUNG WOOK, KIM, TAE HOON, HONG, JU PYO, CHOI, SEOG MOON, HA, JOB
Year of Publication 02.02.2009
Get full text
Year of Publication 02.02.2009
Patent