Nanoscale heat transport through the hetero-interface of SrRuO3 thin films
Jeong, D G, Ju, H I, Choi, Y G, Roh, C J, Woo, S, Choi, W S, Lee, J S
Published in Nanotechnology (13.09.2019)
Published in Nanotechnology (13.09.2019)
Get full text
Journal Article
Covalent-bonding-induced strong phonon scattering in the atomically thin WSe 2 layer
Choi, Young-Gwan, Jeong, Do-Gyeom, Ju, H I, Roh, C J, Kim, Geonhwa, Mun, Bongjin Simon, Kim, Tae Yun, Kim, Sang-Woo, Lee, J S
Published in Scientific reports (01.12.2019)
Published in Scientific reports (01.12.2019)
Get full text
Journal Article
Covalent-bonding-induced strong phonon scattering in the atomically thin WSe2 layer
Choi, Young-Gwan, Jeong, Do-Gyeom, Ju, H. I., Roh, C. J., Kim, Geonhwa, Mun, Bongjin Simon, Kim, Tae Yun, Kim, Sang-Woo, Lee, J. S.
Published in Scientific reports (20.05.2019)
Published in Scientific reports (20.05.2019)
Get full text
Journal Article
Nanoscale heat transport through the hetero-interface of SrRuO 3 thin films
Jeong, D G, Ju, H I, Choi, Y G, Roh, C J, Woo, S, Choi, W S, Lee, J S
Published in Nanotechnology (13.09.2019)
Published in Nanotechnology (13.09.2019)
Get full text
Journal Article
Silent cerebral embolism after left atrial appendage occlusion
Wang, K, Wang, Z I D U N, Ju, W E I Z H U, Chen, M I N G L O
Published in European heart journal (09.11.2023)
Published in European heart journal (09.11.2023)
Get full text
Journal Article
Covalent-bonding-induced strong phonon scattering in the atomically thin WSe2 layer
Choi, Young-Gwan, Jeong, Do-Gyeom, Ju, H. I, Roh, C. J, Kim, Geonhwa, Mun, Bongjin Simon, Kim, Tae Yun, Kim, Sang-Woo, Lee, J. S
Year of Publication 06.12.2018
Year of Publication 06.12.2018
Get full text
Journal Article
Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation
Hong, Ju Hi, Lee, Yeonhee, Han, Seunghee, Kim, Kang-Jin
Published in Surface & coatings technology (12.09.2006)
Published in Surface & coatings technology (12.09.2006)
Get full text
Journal Article
Investigation of improved adhesion between Cu film and polyimide by the PSII-EIAMAD technique
Lee, Yeonhee, Hong, Ju Hi, Chun, Hyejin, Han, Seunghee
Published in Surface and interface analysis (01.04.2006)
Published in Surface and interface analysis (01.04.2006)
Get full text
Journal Article
Conference Proceeding