Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps
Jeong, Myeong-Hyeok, Lim, Gi-Tae, Kim, Byoung-Joon, Lee, Ki-Wook, Kim, Jae-Dong, Joo, Young-Chang, Park, Young-Bae
Published in Journal of electronic materials (01.11.2010)
Published in Journal of electronic materials (01.11.2010)
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Journal Article
Improvements of mechanical fatigue reliability of Cu interconnects on flexible substrates through MoTi alloy under-layer
Lee, Young-Joo, Shin, Hae-A-Seul, Nam, Dae-Hyun, Yeon, Han-Wool, Nam, Boae, Woo, Kyoohee, Joo, Young-Chang
Published in Electronic materials letters (01.01.2015)
Published in Electronic materials letters (01.01.2015)
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Journal Article
Study of Cu Migration-Induced Failure of Inter-Layer Dielectric
Sang-Soo Hwang, Sung-Yup Jung, Jung-Kyu Jung, Young-Chang Joo
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
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Conference Proceeding
Simulation of the Copper Diffusion Profile in SiO2 during Bias Temperature Stress (BTS) Test
Kwon, Jang-Yeon, Kim, Ki-Su, Joo, Young-Chang, Kim, Ki-Bum
Published in Japanese Journal of Applied Physics (01.02.2002)
Published in Japanese Journal of Applied Physics (01.02.2002)
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Journal Article
In situ study of stress relaxation mechanisms of pure Al thin films during isothermal annealing
Hwang, Soo-Jung, Lee, Yong-Duck, Park, Young-Bae, Lee, Je-Hun, Jeong, Chang-Oh, Joo, Young-Chang
Published in Scripta materialia (01.06.2006)
Published in Scripta materialia (01.06.2006)
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Journal Article
Thermal Transport Properties of Hybrid Bonding With Passivation
Kim, Hakjun, Hwang, Jae Young, Park, Sangwoo, Kim, Sarah Eunkyung, Joo, Young-Chang, Jang, Hyejin
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding